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AVX Multilayer Ceramic Chip Capacitor
Ceramic Chip Capacitors
Table of Contents
Basic Capacitor Formulas. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 How to Order - AVX Part Number Explanation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 C0G (NP0) Dielectric
General Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Typical Characteristic Curves. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Capacitance Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 - 7
X7R Dielectric
General Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Typical Characteristic Curves. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Capacitance Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 - 11
Z5U Dielectric
General Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Typical Characteristic Curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Capacitance Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 - 15
Y5V Dielectric
General Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Typical Characteristic Curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Capacitance Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Low Profile Chips for Z5U & Y5V Dielectric . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 High Voltage Chips for 500V to 5000V Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 - 21 General Specifications
Environmental . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 - 23 Mechanical . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
MIL-PRF-55681/Chips
Part Number Example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Military Part Number Identification (CDR01 thru CDR06) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Military Part Number Identification (CDR31 thru CDR35) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 Military Part Number Identification (CDR31) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 Military Part Number Identification (CDR32) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 Military Part Number Identification (CDR33/34/35). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
European Version CECC 32 101-801 Chips. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 Packaging of Chip Components Automatic Insertion Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 Embossed Carrier Configuration - 8 & 12mm Tape . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 Paper Carrier Configuration - 8 & 12mm Tape . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 Bulk Case Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 MLC Chip Capacitors General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 - 40 Surface Mounting Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 - 43
1
Basic Capacitor Formulas
I. Capacitance (farads) English: C = .224 K A TD Metric: C = .0884 K A TD II. Energy stored in capacitors (Joules, watt - sec) E = 12 CV2 III. Linear charge of a capacitor (Amperes) dV I=C dt IV. Total Impedance of a capacitor (ohms) RS + (XC - XL ) V. Capacitive Reactance (ohms) 1 xc = 2 fC Z=
2 2
XI. Equivalent Series Resistance (ohms) E.S.R. = (D.F.) (Xc) = (D.F.) / (2 fC) XII. Power Loss (watts) Power Loss = (2 fCV2) (D.F.) XIII. KVA (Kilowatts) KVA = 2 fCV2 x 10 -3 XIV. Temperature Characteristic (ppm/C) T.C. = Ct - C25 x 106 C25 (Tt - 25) XV. Cap Drift (%) C1 - C2 C.D. = C1
x 100
XVI. Reliability of Ceramic Capacitors Vt L0 X Tt Y = Lt Vo To
() ()
VI. Inductive Reactance (ohms) xL = 2 fL VII. Phase Angles: Ideal Capacitors: Current leads voltage 90 Ideal Inductors: Current lags voltage 90 Ideal Resistors: Current in phase with voltage VIII. Dissipation Factor (%) (loss angle) = E.S.R. = (2 fC) (E.S.R.) Xc IX. Power Factor (%) P.F. = Sine (loss angle) = Cos (phase angle) f P.F. = (when less than 10%) = DF D.F.= tan X. Quality Factor (dimensionless) Q = Cotan (loss angle) = 1 D.F.
XVII. Capacitors in Series (current the same) 1 = 1 + 1 --- 1 CT C1 C2 CN C1 C2 Two: CT = C1 + C2 XVIII. Capacitors in Parallel (voltage the same) CT = C1 + C2 --- + CN XIX. Aging Rate A.R. = % Any Number:
XX. Decibels
D C/decade of time
db = 20 log V1 V2
METRIC PREFIXES
Pico Nano Micro Milli Deci Deca Kilo Mega Giga Tera X 10-12 X 10-9 X 10-6 X 10-3 X 10-1 X 10+1 X 10+3 X 10+6 X 10+9 X 10+12
SYMBOLS
K A TD V t Rs = Dielectric Constant = Area = Dielectric thickness = Voltage = time = Series Resistance f L = frequency = Inductance = Loss angle Lt Vt Vo Tt To = Test life = Test voltage = Operating voltage = Test temperature = Operating temperature
f
X&Y Lo
= Phase angle = exponent effect of voltage and temp. = Operating life
2
How to Order
Part Number Explanation
EXAMPLE: 08055A101JAT2A
0805
Size (L" x W") 0402 0504 0603 0805 1005 0907 1206 1210 1505 1805 1808 1812 1825 2225 3640
5
A
Dielectric C0G (NP0) = A X7R = C X5R = D Z5U = E Y5V = G
101
J
Capacitance Tolerance = .25 pF* = .50 pF* = 1% ( 25 pF) = 2% ( 13 pF) = 5% = 10% = 20% = +80%, -20% = +100%, -0%
A
T
Terminations
2
A
Special** Code A = Standard Product Non-Standard P = Embossed unmarked M = Embossed marked E = Standard packaging marked Low Profile Chips Only Max. Thickness T = .66mm (.026") S = .56mm (.022") R = .46mm (.018")
C D F G J K M Z P
Standard:
T = Ni and Tin Plated Others: 7 = Plated Ni Gold Plated 1 = Pd/Ag
Voltage 10V = Z 16V = Y 25V = 3 50V = 5 100V = 1 200V = 2 250V = V 500V = 7 600V = C 1000V = A 1500V = S 2000V = G 2500V = W 3000V = H 4000V = J 5000V = K
Capacitance Code (2 significant digits + no. of zeros) Examples: 10 pF = 100 100 pF = 101 1,000 pF = 102 22,000 pF = 223 220,000 pF = 224 1 F = 105 For values below 10 pF, use "R" in place of decimal point, e.g., 9.1 pfd = 9R1.
Failure Rate A = Not Applicable
Packaging**
Recommended:
2 =7" Reel 4 =13" Reel Others: 7 = Bulk Cassette 9 = Bulk
* C&D tolerances for 10 pF values. ** Standard Tape and Reel material depends upon chip size and thickness. See individual part tables for tape material type for each capacitance value. Note: Unmarked product is standard. Marked product is available on special request, please contact AVX. Standard packaging is shown in the individual tables. Non-standard packaging is available on special request, please contact AVX.
3
C0G (NP0) Dielectric
General Specifications
C0G (NP0) is the most popular formulation of the "temperature-compensating," EIA Class I ceramic materials. Modern C0G (NP0) formulations contain neodymium, samarium and other rare earth oxides. C0G (NP0) ceramics offer one of the most stable capacitor dielectrics available. Capacitance change with temperature is 0 30ppm/C which is less than 0.3% C from -55C to +125C. Capacitance drift or hysteresis for C0G (NP0) ceramics is negligible at less than 0.05% versus up to 2% for films. Typical capacitance change with life is less than 0.1% for C0G (NP0), one-fifth that shown by most other dielectrics. C0G (NP0) formulations show no aging characteristics. The C0G (NP0) formulation usually has a "Q" in excess of 1000 and shows little capacitance or "Q" changes with frequency. Their dielectric absorption is typically less than 0.6% which is similar to mica and most films.
PART NUMBER (see page 3 for complete part number explanation)
0805
Size (L" x W")
5
Voltage 25V = 3 50V = 5 100V = 1 200V = 2
A
Dielectric C0G (NP0) = A
101
Capacitance Code
J
Capacitance Tolerance Preferred K = 10% J = 5%
A
Failure Rate A = Not Applicable
T
Terminations T = Plated Ni and Solder
2
Packaging 2 = 7" Reel 4 = 13" Reel
A
Special Code A = Std. Product
PERFORMANCE CHARACTERISTICS
Capacitance Range Capacitance Tolerances 0.5 pF to .1 F (1.0 0.2 Vrms, 1kHz, for 100 pF use 1 MHz) Preferred 5%, 10% others available: .25 pF, .5 pF, 1% (25pF), 2%(13pF), 20% For values 10 pF preferred tolerance is .5 pF, also available .25 pF. -55C to +125C 0 30 ppm/C (EIA C0G) 25, 50, 100 & 200 VDC (+125C) For values >30 pF: 0.1% max. (+25C and +125C) For values 30 pF: "Q" = 400 + 20 x C (C in pF) 100,000 megohms min. or 1000 M - F min., whichever is less 10,000 megohms min. or 100 M - F min., whichever is less 250% of rated voltage for 5 seconds at 50 mamp max. current 1 0.2 Vrms For values 100 pF: 1 MHz For values >100 pF: 1 KHz
Operating Temperature Range Temperature Characteristic Voltage Ratings Dissipation Factor and "Q" Insulation Resistance (+25C, RVDC) Insulation Resistance (+125C, RVDC) Dielectric Strength Test Voltage Test Frequency
4
C0G (NP0) Dielectric
Typical Characteristic Curves**
Temperature Coefficient
Typical Capacitance Change Envelope: 0 30 ppm/C
Variation of Impedance with Cap Value Impedance vs. Frequency 0805 - C0G (NP0) 10 pF vs. 100 pF vs. 1000 pF
100,000
Capacitance
10,000
+0.5
-0.5
Impedance,
0
1,000
%
100 10.0 10 pF
-55 -35 -15 +5 +25 +45 +65 +85 +105 +125
1.0 0.1 1 10 100 100 pF 1000 pF 1000
Temperature C
Capacitance vs. Frequency
+2
Frequency, MHz
Capacitance
+1 0 -1 -2
Variation of Impedance with Chip Size Impedance vs. Frequency 1000 pF - C0G (NP0)
10 1206 0805 1812 1210 1.0
1KHz
10 KHz
100 KHz
1 MHz
10 MHz
0.1 10
Frequency
Impedance,
%
100
1000
Insulation Resistance (Ohm-Farads)
Insulation Resistance vs Temperature
10,000
Frequency, MHz
1,000
Variation of Impedance with Ceramic Formulation Impedance vs. Frequency 1000 pF - C0G (NP0) vs X7R 0805
10.00 X7R NPO
Impedance,
+20 +25 +40 +60 +80 +100
100
1.00
0.10
0
Temperature C
0.01 10
100
1000
Frequency, MHz
SUMMARY OF CAPACITANCE RANGES VS. CHIP SIZE
Style 0402* 0504 0603* 0805* 1206* 1210* 1505 1808 1812* 1825* 2220 2225 25V 0.5pF - 220pF 0.5pF - 330pF 0.5pF - 1nF 0.5pF - 4.7nF 0.5pF - 10nF 560pF - 10nF -- 1nF - 15nF 50V 0.5pF - 120pF 0.5pF - 150pF 0.5pF - 1nF 0.5pF - 2.2nF 0.5pF - 4.7nF 560pF - 10nF 10pF - 1.5nF 1nF - 4.7nF 1nF - 10nF 1nF - 22nF 4.7nF - 47nF 1nF - 100nF 100V -- 0.5pF - 68pF 0.5pF - 330pF 0.5pF - 1nF 0.5pF - 2.2nF 560pF - 3.9nF 10pF - 820pF 1nF - 3.9nF 1nF - 4.7nF 1nF - 12nF 4.7nF - 39nF 1nF - 39nF 200V -- -- -- 0.5pF - 470pF 0.5pF - 1nF 560pF - 1.5nF 10pF - 560pF 1nF - 2.2nF 1nF - 3.3nF 1nF - 6.8nF 3.3nF - 27nF 1nF - 39nF
* Standard Sizes ** For additional information on performance changes with operating conditions consult AVX's software SpiCap.
5
C0G (NP0) Dielectric
Capacitance Range
PREFERRED SIZES ARE SHADED
SIZE
Standard Reel Packaging
MM (in.) MM (W) Width (in.) (T) Max. Thickness MM (in.) MM (t) Terminal (in.) (L) Length WVDC Cap (pF) 0.5 1.0 1.2 1.5 1.8 2.2 2.7 3.3 3.9 4.7 5.6 6.8 8.2 10 12 15 18 22 27 33 39 47 56 68 82 100 120 150 180 220 270 330 390 470 560 680 820 1000 1200 1500 1800 2200 2700 3300 3900 4700 5600 6800 8200 10000
0402*
All Paper
1.00 .10 (.040 .004) .50 .10 (.020 .004) .60 (.024) .25 .15 (.010 .006) 25 50 25
0504*
All Embossed
1.27 .25 (.050 .010) 1.02 .25 (.040 .010) 1.02 (.040) .38 .13 (.015 .005) 50 100 25
0603*
All Paper
1.60 .15 (.063 .006) .81 .15 (.032 .006) .90 (.035) .35 .15 (.014 .006) 50 100 25
0805
Paper/Embossed
2.01 .20 (.079 .008) 1.25 .20 (.049 .008) 1.30 (.051) .50 .25 (.020 .010) 50 100 200 25
1206
Paper/Embossed
3.20 .20 (.126 .008) 1.60 .20 (.063 .008) 1.50 (.059) .50 .25 (.020 .010) 50 100 200 50
1505
All Embossed
3.81 .25 (.150 .010) 1.27 .25 (.050 .010) 1.27 (.050) .50 .25 (.020 .010) 100 200
L
W T
t
*Reflow soldering only.
NOTES: For higher voltage chips, see pages 20 and 21.
= Paper Tape = Embossed Tape
6
C0G (NP0) Dielectric
Capacitance Range
PREFERRED SIZES ARE SHADED
SIZE
Standard Reel Packaging
(L) Length (W) Width (T) Max. Thickness (t) Terminal WVDC Cap (pF) 560 680 820 1000 1200 1500 1800 2200 2700 3300 3900 4700 5600 6800 8200 Cap. (F) .010 .012 .015 .018 .022 .027 .033 .039 .047 .068 .082 .1 MM (in.) MM (in.) MM (in.) MM (in.) 25
1210
Paper/Embossed
3.20 .20 (.126 .008) 2.50 .20 (.098 .008) 1.70 (.067) .50 .25 (.020 .010) 50 100 200
1808*
All Embossed
4.57 .25 (.180 .010) 2.03 .25 (.080 .010) 1.52 (.060) .64 .39 (.025 .015) 50 100
1812*
All Embossed
4.50 .30 (.177 .012) 3.20 .20 (.126 .008) 1.70 (.067) .61 .36 (.024 .014) 50 100
1825*
All Embossed
4.50 .30 (.177 .012) 6.40 .40 (.252 .016) 1.70 (.067) .61 .36 (.024 .014) 50 100 200
2220*
All Embossed
5.7 .40 (.225 .016) 5.0 .40 (.197 .016) 2.30 (.090) .64 .39 (.025 .015) 100 200
2225*
All Embossed
5.72 .25 (.225 .010) 6.35 .25 (.250 .010) 1.70 (.067) .64 .39 (.025 .015) 50 100 200
200
25
200
50
L
W T
t
*Reflow soldering only.
NOTES: For higher voltage chips, see pages 20 and 21.
= Paper Tape = Embossed Tape
7
X7R Dielectric
General Specifications
X7R formulations are called "temperature stable" ceramics and fall into EIA Class II materials. X7R is the most popular of these intermediate dielectric constant materials. Its temperature variation of capacitance is within 15% from -55C to +125C. This capacitance change is non-linear. Capacitance for X7R varies under the influence of electrical operating conditions such as voltage and frequency. X7R dielectric chip usage covers the broad spectrum of industrial applications where known changes in capacitance due to applied voltages are acceptable.
PART NUMBER (see page 3 for complete part number explanation)
0805
Size (L" x W")
5
Voltage 10V = Z 16V = Y 25V = 3 50V = 5 100V = 1
C
Dielectric X7R = C
103
Capacitance Code
M
Capacitance Tolerance Preferred M = 20% K = 10%
A
Failure Rate A = Not Applicable
T
Terminations T = Plated Ni and Solder
2
Packaging 2 = 7" Reel 4 = 13" Reel
A
Special Code A = Std. Product
PERFORMANCE CHARACTERISTICS
Capacitance Range Capacitance Tolerances Operating Temperature Range Temperature Characteristic Voltage Ratings Dissipation Factor 100 pF to 2.2 F (1.0 0.2 Vrms, 1kHz) Preferred 10%, 20% others available: 5%, +80 -20% -55C to +125C 15% (0 VDC) 10, 16, 25, 50, 100 VDC (+125C) For 50 volts and 100 volts: 2.5% max. For 25 volts: 3.0% max. For 16 volts: 3.5% max. For 10 volts: 5% max. 100,000 megohms min. or 1000 M - F min., whichever is less 10,000 megohms min. or 100 M - F min., whichever is less 250% of rated voltage for 5 seconds at 50 mamp max. current 1.0 0.2 Vrms 1 KHz
Insulation Resistance (+25C, RVDC) Insulation Resistance (+125C, RVDC) Dielectric Strength Test Voltage Test Frequency
8
X7R Dielectric
Typical Characteristic Curves**
Temperature Coefficient
+12 +6
Variation of Impedance with Cap Value Impedance vs. Frequency 1,000 pF vs. 10,000 pF - X7R 0805
10.00 1,000 pF 10,000 pF
Capacitance
0 -6 -12 -18 -24 -75 -50 -25 0 +25 +50 +75 +100 +125 0.01 10 100 1.00
Impedance, Temperature C
%
0.10
1000
Frequency, MHz
Capacitance vs. Frequency
+20
Variation of Impedance with Chip Size Impedance vs. Frequency 10,000 pF - X7R
10 1206 0805 1210
Capacitance
+10 0 -10 -20
Impedance,
1.0
0.1
%
.01 1KHz 10 KHz 100 KHz 1 MHz 10 MHz 1 10
100
1,000
Frequency
Frequency, MHz
Insulation Resistance (Ohm-Farads)
Insulation Resistance vs Temperature
10,000
Variation of Impedance with Chip Size Impedance vs. Frequency 100,000 pF - X7R
10 1206 0805 1210
1,000
100
Impedance,
+20 +25 +40 +60 +80 +100
1.0
0.1
0
.01 1 10
Temperature C
100
1,000
Frequency, MHz
SUMMARY OF CAPACITANCE RANGES VS. CHIP SIZE
Style 0402* 0504 0603* 0805* 1206* 1210* 1505 1808 1812* 1825* 2220 2225 10V -- -- 100pF - 0.22F 100pF - 2.2F 1.5F - 4.7F 16V 100pF - 47nF -- 100pF - 0.1F 100pF - 0.47F 1nF - 1F 1nF - 1.8F 25V 100pF - 6.8nF -- 100pF - 47nF 100pF - 0.22F 1nF - 1.0F 1nF - 1F 10nF - 0.33F 50V 100pF - 3.9nF 100pF - .01F 100pF - 15nF 100pF - 0.1F 1nF - 0.22F 1nF - 0.22F 1nF - 0.1F 10nF - 0.33F 10nF - 1F 10nF - 1F 10nF - 1.5F 10nF - 2.2F 100V -- 100pF - 3.3nF 100pF - 4.7nF 100pF - 22nF 1nF - 0.1F 1nF - 0.1F 1nF - 27nF 10nF - 0.1F 10nF - 0.47F 10nF - 0.47F 10nF - 1.2F 10nF - 1.5F
* Standard Sizes ** For additional information on performance changes with operating conditions consult AVX's software SpiCap.
9
X7R Dielectric
Capacitance Range
PREFERRED SIZES ARE SHADED
SIZE
Standard Reel Packaging
MM (in.) MM (W) Width (in.) (T) Max. Thickness MM (in.) MM (t) Terminal (in.) WVDC (L) Length Cap (pF) 100 120 150 180 220 270 330 390 470 560 680 820 1000 1200 1500 1800 2200 2700 3300 3900 4700 5600 6800 8200 Cap. (F) .010 .012 .015 .018 .022 .027 .033 .039 .047 .056 .068 .082 .10 .12 .15 .18 .22 .27 .33 .47 .56 .68 .82 1.0 1.2 1.5 1.8 2.2 4.7
0402*
All Paper
1.00 .10 (.040 .004) .50 .10 (.020 .004) .60 (.024) .25 .15 (.010 .006) 25
0504*
All Embossed
1.27 .25 (.050 .010) 1.02 .25 (.040 .010) 1.02 (.040) .38 .13 (.015 .005) 50 100
0603*
All Paper
1.60 .15 (.063 .006) .81 .15 (.032 .006) .90 (.035) .35 .15 (.014 .006) 16 25 50
0805
Paper/Embossed
2.01 .20 (.079 .008) 1.25 .20 (.049 .008) 1.30 (.051) .50 .25 (.020 .010) 16 25 50
1206
Paper/Embossed
3.20 .20 (.126 .008) 1.60 .20 (.063 .008) 1.50 (.059) .50 .25 (.020 .010) 16 25 50
1505
All Embossed
3.81 .25 (.150 .010) 1.27 .25 (.050 .010) 1.27 (.050) .50 .25 (.020 .010) 50 100
16
50
10
100
10
100
10
100
L
W T
t
*Reflow soldering only.
NOTES: For higher voltage chips, see pages 20 and 21.
= Paper Tape = Embossed Tape
10
X7R Dielectric
Capacitance Range
PREFERRED SIZES ARE SHADED
SIZE
Standard Reel Packaging
(L) Length (W) Width (T) Max. Thickness (t) Terminal WVDC Cap (pF) 1000 1200 1500 1800 2200 2700 3300 3900 4700 5600 6800 8200 Cap. (F) .010 .012 .015 .018 .022 .027 .033 .039 .047 .056 .068 .082 .10 .12 .15 .18 .22 .27 .33 .39 .47 .56 .68 .82 1.0 1.2 1.5 1.8 2.2 MM (in.) MM (in.) MM (in.) MM (in.) 16
1210
Paper/Embossed
3.20 .20 (.126 .008) 2.50 .20 (.098 .008) 1.70 (.067) .50 .25 (.020 .010) 25 50 100 25
1808*
All Embossed
4.57 .25 (.180 .010) 2.03 .25 (.080 .010) 1.52 (.060) .64 .39 (.025 .015) 50 100 50
1812*
All Embossed
4.50 .30 (.177 .012) 3.20 .20 (.126 .008) 1.70 (.067) .61 .36 (.024 .014) 100
1825*
All Embossed
4.50 .30 (.177 .012) 6.40 .40 (.252 .016) 1.70 (.067) .61 .36 (.024 .014) 50 100 50
2220*
All Embossed
5.7 0.4 (.225 .016) 5.0 0.4 (.197 .016) 2.30 (.090) .64 .39 (.025 .015) 100 200
2225*
All Embossed
5.72 .25 (.225 .010) 6.35 .25 (.250 .010) 1.70 (.067) .64 .39 (.025 .015) 50 100
L
W T
t
*Reflow soldering only.
NOTES: For higher voltage chips, see pages 20 and 21.
= Paper Tape = Embossed Tape
11
Z5U Dielectric
General Specifications
Z5U formulations are "general-purpose" ceramics which are meant primarily for use in limited temperature applications where small size and cost are important. Z5U show wide variations in capacitance under influence of environmental and electrical operating conditions. Despite their capacitance instability, Z5U formulations are very popular because of their small size, low ESL, low ESR and excellent frequency response. These features are particularly important for decoupling application where only a minimum capacitance value is required.
PART NUMBER (see page 3 for complete part number explanation)
0805
Size (L" x W")
5
Voltage 25V = 3 50V = 5
E
Dielectric Z5U = E
104
Capacitance Code
Z
Capacitance Tolerance Preferred Z = +80% -20% M = 20%
A
Failure Rate A = Not Applicable
T
Terminations T = Plated Ni and Solder
2
Packaging 2 = 7" Reel 4 = 13" Reel
A
Special Code A = Std. Product
PERFORMANCE CHARACTERISTICS
Capacitance Range Capacitance Tolerances Operating Temperature Range Temperature Characteristic Voltage Ratings Dissipation Factor Insulation Resistance (+25C, RVDC) Dielectric Strength Test Voltage Test Frequency 0.01 F to 1.0 F Preferred +80 -20% others available: 20%, +100 -0% +10C to +85C +22% to -56% max. 25 and 50VDC (+85C) 4% max. 10,000 megohms min. or 1000 M - F min., whichever is less 250% of rated voltage for 5 seconds at 50 mamp max. current 0.5 0.2 Vrms 1 KHz
12
Z5U Dielectric
Typical Characteristic Curves**
Temperature Coefficient
+30 +20 +10 0 -10 -20 -30 -40 -50 -60 +10 +25 +30 +35 +40 +45 +50 +55 +65 +85
Capacitance
Variation of Impedance with Cap Value Impedance vs. Frequency 1206 -Z5U
100.00
10.00
Impedance,
%
10,000 pF 1.00 100,000 pF 0.10
Temperature C
0.01 1
10
100
1,000
Frequency, MHz
Capacitance vs. Frequency
Capacitance
1000 0 -10 -20 -30 -40 1KHz 10 KHz 100 KHz 1 MHz 10 MHz 100
Variation of Impedance with Chip Size Impedance vs. Frequency .33 F - Z5U
Z5U 1206 Z5U 1210 Z5U 1812
|Z| (ohms) Frequency
10
%
1
0.1 0.001
0.01
0.1
1
10
100
1,000
Frequency, MHz
Insulation Resistance (Ohm-Farads)
nsu ation Resistance vs Temperature
100,000
Variation of Impedance with Ceramic Formulation Impedance vs. Frequency .1 F X7R vs. Z5U 0805
10000 1000 X7R 0805 Z5U 0805
10,000
|Z| (ohms)
+20 +30 +40 +50 +60 +70 +80
1,000
100 10 1 0.1 0.01 0.001 0.01 0.1 1 10 100 1,000
100
0
Temperature C
Frequency, MHz
SUMMARY OF CAPACITANCE RANGES VS. CHIP SIZE
Style 0603* 0805* 1206* 1210* 1808 1812* 1825* 2225 25V .01F - .047F .01F - .12F .01F - .33F .01F - .56F .01F - .56F .01F - 1.0F .01F - 1.0F .01F - 1.0F 50V .01F - .027F .01F - 0.1F .01F - .33F .01F - .47F .01F - .47F .01F - 1.0F .01F - 1.0F .01F - 1.0F
* Standard Sizes ** For additional information on performance changes with operating conditions consult AVX's software SpiCap.
13
Z5U Dielectric
Capacitance Range
PREFERRED SIZES ARE SHADED
SIZE
Standard Reel Packaging (L) Length (W) Width (T) Max. Thickness (t) Terminal MM (in.) MM (in.) MM (in.) MM (in.)
0603*
All Paper 1.60 .15 (.063 .006) .81 .15 (.032 .006) .90 (.035) .35 .15 (.014 .006)
0805
Paper/Embossed 2.01 .20 (.079 .008) 1.25 .20 (.049 .008) 1.30 (.051) .50 .25 (.020 .010)
1206
Paper/Embossed 3.20 .20 (.126 .008) 1.60 .20 (.063 .008) 1.50 (.059) .50 .25 (.020 .010)
1210
Paper/Embossed 3.20 .20 (.126 .008) 2.50 .20 (.098 .008) 1.70 (.067) .50 .25 (.020 .010)
WVDC Cap (F) .010 .012 .015 .018 .022 .027 .033 .039 .047 .056 .068 .082 .10 .12 .15 .18 .22 .27 .33 .39 .47 .56 .68 .82 1.0 1.5
25
50
25
50
25
50
25
50
L
W T
t
*Reflow soldering only.
NOTES: For low profile chips, see page 19.
= Paper Tape = Embossed Tape
14
Z5U Dielectric
Capacitance Range
PREFERRED SIZES ARE SHADED
SIZE
Standard Reel Packaging
1808*
All Embossed 04.57 .25 (.180 .010) 2.03 .25 (.080 .010) 1.52 (.060) .64 .39 (.025 .015) MM (in.) MM (in.) MM (in.) MM (in.)
1812*
All Embossed 4.50 .30 (.177 .012) 3.20 .20 (.126 .008) 1.70 (.067) .61 .36 (.024 .014)
1825*
All Embossed 4.50 .30 (.177 .012) 6.40 .40 (.252 .016) 1.70 (.067) .61 .36 (.024 .014)
2225*
All Embossed 5.72 .25 (.225 .010) 6.35 .25 (.250 .010) 1.70 (.067) .64 .39 (.025 .015)
(L) Length
(W) Width (T) Max. Thickness (t) Terminal
WVDC Cap (F) .010 .012 .015 .018 .022 .027 .033 .039 .047 .056 .068 .082 .10 .12 .15 .18 .22 .27 .33 .39 .47 .56 .68 .82 1.0 1.5
25
50
25
50
25
50
25
50
L
W T
t
*Reflow soldering only.
NOTES: For low profile chips, see page 19.
= Paper Tape = Embossed Tape
15
Y5V Dielectric
General Specifications
Y5V formulations are for general-purpose use in a limited temperature range. They have a wide temperature characteristic of +22% -82% capacitance change over the operating temperature range of -30C to +85C. Y5V's high dielectric constant allows the manufacture of the highest capacitance value in a given case size. These characteristics make Y5V ideal for decoupling applications within limited temperature range.
PART NUMBER (see page 3 for complete part number explanation)
0805
Size (L" x W")
3
Voltage 10V = Z 16V = Y 25V = 3 50V = 5
G
Dielectric Y5V = G
104
Capacitance Code
Z
Capacitance Tolerance Z = +80 -20%
A
Failure Rate A = Not Applicable
T
Terminations T = Plated Ni and Solder
2
Packaging 2 = 7" Reel 4 = 13" Reel
A
Special Code A = Std. Product
PERFORMANCE CHARACTERISTICS
Capacitance Range Capacitance Tolerances Operating Temperature Range Temperature Characteristic Voltage Ratings Dissipation Factor 2200 pF to 22 F +80 -20% -30C to +85C +22% to -82% max. within operating temperature 10, 16, 25 and 50 VDC (+85C) For 50 volts: 5.0% max. For 16 and 25 volts: 7% max. For 10 volts: 10% max. 10,000 megohms min. or 1000 M - F min., whichever is less 250% of rated voltage for 5 seconds at 50 mamp max. current 1.0 Vrms 0.2 Vrms 1 KHz
Insulation Resistance (+25C, RVDC) Dielectric Strength Test Voltage Test Frequency
16
Y5V Dielectric
Typical Characteristic Curves**
Temperature Coefficient
+20 +10 0 -10 -20 -30 -40 -50 -60 -70 -80 -55 -35 -15 +5 +25 +45 +65 +85 +105 +125 10,000 1,000
0.1 F - 0603 Impedance vs. Frequency
Capacitance
|Z| (Ohms)
100 10 1 0.1 0.01 10,000
%
100,000
1,000,000
10,000,000
Temperature C
Frequency (Hz)
Capacitance Change vs. DC Bias Voltage
+40 +20 0 -20 -40 -60 -80 -100 0 20 40 60 80 100
0.22 F - 0805 Impedance vs. Frequency
1,000 100
|Z| (Ohms)
c/c (%)
10 1 0.1 0.01 10,000
100,000
1,000,000
10,000,000
DC Bias Voltage
Frequency (Hz)
Insulation Resistance (Ohm-Farads)
Insulation Resistance vs. Temperature
10,000 1,000 100
1 F - 1206 Impedance vs. Frequency
1,000
|Z| (Ohms)
+20 +30 +40 +50 +60 +70 +80 +85
10 1 0.1
100
0
Temperature C
0.01 10,000
100,000
1,000,000
10,000,000
Frequency (Hz)
SUMMARY OF CAPACITANCE RANGES VS. CHIP SIZE
Style 0402* 0603* 0805* 1206* 1210* 1812* 1825* 2220 2225 10V 2.2nF - 0.1F 2.2nF - 1F 10nF - 4.7F 10nF - 10F 10nF - 22F -- 16V 2.2nF - 0.1F 2.2nF - 0.33F 10nF - 2.2F 10nF - 4.7F 0.1F - 10F -- 25V 2.2nF - 22nF 2.2nF - 0.22F 10nF - 1F 10nF - 2.2F 0.1F - 4.7F 0.15F - 1.5F 0.47F - 1.5F -- 0.68F - 2.2F 50V 2.2nF - 10nF 2.2nF - 56nF 10nF - 0.33F 10nF - 1F 0.1F - 1F 1.5nF - 1.5F 0.47F - 1.5F 1F - 1.5F 0.68F - 1.5F
* Standard Sizes ** For additional information on performance changes with operating conditions consult AVX's software SpiCap.
17
Y5V Dielectric
Capacitance Range
PREFERRED SIZES ARE SHADED
SIZE
Standard Reel Packaging
(L) Length (W) Width (T) Max. Thickness (t) Terminal WVDC Cap (pF) 3900 4700 5600 6800 8200 Cap (F) .01 .012 .015 .018 .022 .027 .033 .039 .047 .056 .068 .082 .10 .12 .15 .18 .22 .27 .33 .39 .47 .56 .68 .82 1.0 1.2 1.5 1.8 2.2 2.7 3.3 3.9 4.7 5.6 6.8 8.2 10.0 12.0 15.0 18.0 22.0 2200 2700 3300 MM (in.) MM (in.) MM (in.) MM (in.) 10
0402*
All Paper
1.00 .10 (.040 .004) .50 .10 (.020 .004) .60 (.024) .25 .15 (.010 .006) 16 25 50 10
0603*
All Paper
1.60 .15 (.063 .006) .81 .15 (.032 .006) .90 (.035) .35 .15 (.014 .006) 16 25 50 10
0805
1206
1210
1812*
All Embossed
4.50 .30 (.177 .012) 3.20 .20 (.126 .008) 1.70 (.067) .61 .36 (.024 .014) 50 25 50
1825*
All Embossed
4.50 .30 (.252 .016) 6.40 .40 (.252 .016) 1.70 (.067) .61 .36 (.024 .014) 25 50
2220*
All Embossed
5.7 0.4 (.225 .016) 5.0 0.4 (.197 .016) 2.30 (.090) .64 .39 (.025 .015) 50
2225*
All Embossed
5.72 .25 (.225 .010) 6.35 .25 (.250 .010) 1.70 (.067) .64 .39 (.025 .015) 25 50
Paper/Embossed Paper/Embossed Paper/Embossed
2.01 .20 (.079 .008) 1.25 .20 (.049 .008) 1.30 (.051) .50 .25 (.020 .010) 16 25 50 10 3.20 .20 (.126 .008) 1.60 .20 (.063 .008) 1.50 (.059) .50 .25 (.020 .010) 16 25 50 3.20 .20 (.126 .008) 2.50 .20 (.098 .008) 1.70 (.067) .50 .25 (.020 .010) 10 16 25
L
W T
t
*Reflow soldering only.
= Paper Tape NOTES: For low profile product, see page 19. = Embossed Tape
18
Low Profile Chips
Z5U & Y5V Dielectric
PART NUMBER (see page 3 for complete information and options)
1206
Size (L" x W")
3
Voltage 25V = 3
E
Dielectric Z5U = E Y5V = G
224
Capacitance Code
Z
Capacitance Tolerance Z = +80/-20%
A
Failure Rate A = Not Applicable
T
Terminations T = Plated Ni and Solder
2
Packaging 2 = 7" Reel 4 = 13" Reel
T
Thickness T = .026" Max. S = .022" Max. R = .018" Max.
PERFORMANCE CHARACTERISTICS
Capacitance Range Capacitance Tolerances Operating Temperature Range Temperature Characteristic Voltage Ratings Dissipation Factor 25C, .5 Vrms, 1kHz Insulation Resistance Dielectric Strength for 5 seconds at 50 mamp max. current Test Voltage Test Frequency Z5U: .01 - .33F; Y5V: .01 - .47F +80, -20% Z5U: +10C to +85C; Y5V: -30C to +85C Z5U: +22%, -56%; Y5V: +22%, -82% 25 VDC Z5U: 4%; Y5V: 7% 10,000 megohms min. or 1000 M - F whichever is less 250% of rated VDC Z5U: 0.5 0.2 Vrms Y5V: 1.0 Vrms 0.2 Vrms 1 KHz
CAPACITANCE VALUES FOR VARIOUS THICKNESSES
Z5U
SIZE
(L) Length (W) Width (t) Terminal MM (in.) MM (in.) MM (in.)
Y5V
1206 1210
3.2 .2 (.126 .008) 2.5 .2 (.098 .008) .50 .25 (.020 .010) .66 (.026) .46 (.018) .56 (.022) .66 (.026)
0805
2.01 .20 (.079 .008) 1.25 .20 (.049 .008) .50 .25 (.020 .010) .46 (.018) .56 (.022) .66 (.026)
SIZE
(L) Length (W) Width (t) Terminal (T) Thickness Max. Cap (F) MM (in.) MM (in.) MM (in.) MM (in.) .01 .012 .015 .018 .022 .027 .033 .039 .047 .056 .068 .082 .1 .12 .15 .18 .22 .27 .33 .39 .47 .46 (.018)
0805
2.01 .20 (.079 .008) 1.25 .20 (.049 .008) .50 .25 (.020 .010) .56 (.022) .66 (.026)
1206
3.2 .2 (.126 .008) 1.6 .2 (.063 .008) .50 .25 (.020 .010) .46 (.018) .56 (.022) .66 (.026)
1210
3.2 .2 (.126 .008) 2.5 .2 (.098 .008) .50 .25 (.020 .010) .46 (.018) .56 (.022) .66 (.026)
3.2 .2 (.126 .008) 1.6 .2 (.063 .008) .50 .25 (.020 .010) .46 (.018) .56 (.022)
(T) Thickness MM Max. (in.) Cap (F) .01 .012 .015 .018 .022 .027 .033 .039 .047 .056 .068 .082 .1 .12 .15 .18 .22 .27 .33 .39 .47
= Paper Tape
= Paper Tape
19
High Voltage Chips
For 500V to 5000V Applications
High value, low leakage and small size are difficult parameters to obtain in capacitors for high voltage systems. AVX special high voltage MLC chips capacitors meet these performance characteristics and are designed for applications such as snubbers in high frequency power converters, resonators in SMPS, and high voltage coupling/DC blocking. These high voltage chip designs exhibit low ESRs at high frequencies. High voltage chips are typically larger than standard voltage rated chips. These larger sizes require that special precautions be taken in applying these chips in surface mount assemblies. This is due to differences in the coefficient of thermal expansion (CTE) between the substrate materials and chip capacitors.
PART NUMBER (see page 3 for complete information and options)
1808 A A 271 K A 1 1 A
AVX Style 1206 1210 1808 1812 1825 2225 3640
Voltage 500V = 7 600V = C 1000V = A 1500V = S 2000V = G 2500V = W 3000V = H 4000V = J 5000V = K
Temperature Capacitance Capacitance Coefficient Code Tolerance C0G = A (2 significant digits C0G: J= 5% K= 10% + no. of zeros) X7R = C M= 20% Examples: 10pF = 100 X7R: K= 10% 100pF = 101 M= 20% 1,000pF = 102 Z= +80% 22,000pF = 223 - 20% 220,000pF = 224 1F = 105
Failure Rate A=Not applicable
Termination Packaging 1= Pd/Ag 1 = 7" Reel T= Plated Ni Embossed and Solder Tape 3 = 13" Reel Embossed Tape 9 = Bulk
Special Code A = Standard
20
High Voltage Chips
For 500V to 5000V Applications
C0G (NP0) Dielectric
PERFORMANCE CHARACTERISTICS
Capacitance Range Capacitance Tolerances Dissipation Factor Operating Temperature Range Temperature Characteristic Voltage Ratings Insulation Resistance (+25C, at 500 VDC) Insulation Resistance (+125C, at 500 VDC) Dielectric Strength Thickness
VOLTAGE 500 600 1000 1500 2000 2500 3000 4000 5000 1206 680 pF 680 pF 330 pF 120 pF 68 pF -- -- -- -- 1210 1500 pF 1500 pF 680 pF 270 pF 120 pF -- -- -- --
100 pF to .047 F (25C, 1.0 0.2 Vrms at 1kHz) 5%, 10%, 20% 0.1% max. (+25C, 1.0 0.2 Vrms, 1kHz) -55C to +125C 0 30 ppm/C (0 VDC) 500, 600, 1000, 1500, 2000, 2500, 3000, 4000 & 5000 VDC (+125C) 100,000 megohms min. or 1000 M - F min., whichever is less 10,000 megohms min. or 100 M - F min., whichever is less 120% rated voltage for 5 seconds at 50 mamp max. current Dependent upon size, voltage, and capacitance value
1808 3300 pF 3300 pF 1500 pF 330 pF 270 pF 100 pF 82 pF -- -- 1812 5600 pF 5600 pF 2200 pF 560 pF 470 pF 220 pF 180 pF -- -- 1825 .012 F .012 F 5600 pF 1500 pF 1200 pF 560 pF 270 pF -- -- 2225 .018 F .018 F 8200 pF 1800 pF 1500 pF 820 pF 680 pF -- -- 3640 -- .047 F .018 F 5600 pF 4700 pF 2700 pF 2200 pF 1000 pF 680 pF
C0G (NP0) MAXIMUM CAPACITANCE VALUES
X7R Dielectric
PERFORMANCE CHARACTERISTICS
Capacitance Range Capacitance Tolerances Dissipation Factor Operating Temperature Range Temperature Characteristic Voltage Ratings Insulation Resistance (+25C, at 500 VDC) Insulation Resistance (+125C, at 500 VDC) Dielectric Strength Thickness 1000 pF to 0.56 F (25C, 1.0 0.2 Vrms at 1kHz) 10%, 20%, +80% -20% 2.5% max. (+25C, 1.0 0.2 Vrms, 1kHz) -55C to +125C 15% (0 VDC) 500, 600, 1000, 1500, 2000, 2500, 3000 & 4000 VDC (+125C) 100,000 megohms min. or 1000 M - F min., whichever is less 10,000 megohms min. or 100 M - F min., whichever is less 120% rated voltage for 5 seconds at 50 mamp max. current Dependent upon size, voltage, and capacitance value
X7R MAXIMUM CAPACITANCE VALUES
VOLTAGE 500 600 1000 1500 2000 2500 3000 4000 1206 .015 F .015 F 4700 pF 1200 pF 470 pF -- -- -- 1210 .027 F .027 F 8200 pF 2700 pF 820 pF -- -- -- 1808 -- .039 F .015 F 2700 pF 1500 pF 1200 pF -- -- 1812 .056 F .068 F .027 F 5600 pF 3300 pF 2200 pF -- -- 1825 -- .15 F .068 F .012 F 6800 pF 5600 pF -- -- 2225 -- .22 F .082 F .018 F .010 F 8200 pF 4700 pF -- 3640 -- .56 F .22 F .056 F .027 F .022 F .018 F 5600 pF
21
General Specifications
Environmental
THERMAL SHOCK
Specification Appearance No visual defects Capacitance Variation C0G (NP0): 2.5% or .25pF, whichever is greater X7R: 7.5% Z5U: 20% Y5V: 20% Q, Tan Delta To meet initial requirement Insulation Resistance C0G (NP0), X7R: To meet initial requirement Z5U, Y5V: Initial Value x 0.1 Dielectric Strength No problem observed Measuring Conditions Step Temperature C Time (minutes) C0G (NP0), X7R: -55 2 1 Z5U: +10 2 30 3 Y5V: -30 2 2 Room Temperature #3 C0G (NP0), X7R: +125 2 3 30 3 Z5U, Y5V: +85 2 4 Room Temperature #3 Repeat for 5 cycles and measure after 48 hours 4 hours (24 hours for C0G (NP0)) at room temperature.
MOISTURE RESISTANCE
Specification Appearance No visual defects Capacitance Variation C0G (NP0): 5% or .5pF, whichever is greater X7R: 10% Z5U: 30% Y5V: 30% Q, Tan Delta C0G (NP0): 30pF........................Q 350 10pF, < 30pF ...........Q 275+5C/2 < 10pF ........................Q 200+10C X7R: Initial requirement + .5% Z5U: Initial requirement + 1% Y5V: Initial requirement + 2% Insulation Resistance Initial Value x 0.3 Measuring Conditions Step Temp. C Humidity % Time (hrs) 1 +25->+65 90-98 2.5 2 +65 90-98 3.0 3 +65->+25 80-98 2.5 4 +25->+65 90-98 2.5 5 +65 90-98 3.0 6 +65->+25 80-98 2.5 7 +25 90-98 2.0 7a -10 uncontrolled - 7b +25 90-98 - Repeat 20 cycles (1-7) and store for 48 hours (24 hours for C0G (NP0)) at room temperature before measuring. Steps 7a & 7b are done on any 5 out of first 9 cycles.
IMMERSION
Specification Appearance No visual defects Capacitance Variation C0G (NP0): 2.5% or .25pF, whichever is greater X7R: 7.5% Z5U: 20% Y5V: 20% Q, Tan Delta To meet initial requirement Insulation Resistance C0G (NP0), X7R: To meet initial requirement Z5U, Y5V: Initial Value x 0.1 Dielectric Strength No problem observed Measuring Conditions Step Temperature C Time (minutes) +65 +5/-0 1 15 2 Pure Water 03 2 15 2 NaCl solution Repeat cycle 2 times and wash with water and dry. Store at room temperature for 48 4 hours (24 hours for C0G (NP0)) and measure.
22
General Specifications
Environmental
STEADY STATE HUMIDITY (No Load)
Specification Appearance No visual defects Capacitance Variation C0G (NP0): 5% or .5pF, whichever is greater X7R: 10% Z5U: 30% Y5V: 30% Q, Tan Delta C0G (NP0): 30pF......................Q 350 10pF, < 30pF.........Q 275+5C/2 < 10pF ....................Q 200+10C X7R: Initial requirement + .5% Z5U: Initial requirement + 1% Y5V: Initial requirement + 2% Insulation Resistance Initial Value x 0.3 Measuring Conditions Store at 85 5% relative humidity and 85C for 1000 hours, without voltage. Remove from test chamber and stabilize at room temperature and humidity for 48 4 hours (24 2 hours for C0G (NP0)) before measuring. Charge and discharge currents must be less than 50ma. Insulation Resistance C0G (NP0), X7R: To meet initial value x 0.3 Z5U, Y5V: Initial Value x 0.1 Charge devices with rated voltage in test chamber set at 85 5% relative humidity and 85C for 1000 (+48,-0) hours. Remove from test chamber and stabilize at room temperature and humidity for 48 4 hours (24 2 hours for C0G (NP0)) before measuring. Charge and discharge currents must be less than 50ma.
LOAD LIFE
Specification Appearance No visual defects Capacitance Variation C0G (NP0): 3% or .3pF, whichever is greater X7R: 10% Z5U: 30% Y5V: 30% Q, Tan Delta C0G (NP0): 30pF......................Q 350 10pF, < 30pF.........Q 275+5C/2 < 10pF ....................Q 200+10C X7R: Initial requirement + .5% Z5U: Initial requirement + 1% Y5V: Initial requirement + 2% Insulation Resistance C0G (NP0), X7R: To meet initial value x 0.3 Z5U, Y5V: Initial Value x 0.1 Charge devices with twice rated voltage in test chamber set at +125C 2C for C0G (NP0) and X7R, +85 2C for Z5U, and Y5V for 1000 (+48,-0) hours. Remove from test chamber and stabilize at room temperature for 48 4 hours (24 2 hours for C0G (NP0)) before measuring. Charge and discharge currents must be less than 50ma.
LOAD HUMIDITY
Specification Appearance No visual defects Capacitance Variation C0G (NP0): 5% or .5pF, whichever is greater X7R: 10% Z5U: 30% Y5V: 30% Q, Tan Delta C0G (NP0): 30pF .....................Q 350 10pF,< 30pF .........Q 275+5C/2 < 10pF ....................Q 200+10C X7R: Initial requirement + .5% Z5U: Initial requirement + 1% Y5V: Initial requirement + 2%
23
General Specifications
Mechanical
END TERMINATION ADHERENCE
Specification No evidence of peeling of end terminal Measuring Conditions After soldering devices to circuit board apply 5N (0.51kg f) for 10 1 seconds, please refer to Figure 1.
5N FORCE
BEND STRENGTH
Speed = 1mm/sec 2mm Deflection R340mm
45mm
45mm
Supports
Figure 2. Bend Strength
DEVICE UNDER TEST TEST BOARD
Figure 1. Terminal Adhesion
RESISTANCE TO VIBRATION
Specification Appearance: No visual defects Capacitance Within specified tolerance Q, Tan Delta To meet initial requirement Insulation Resistance C0G (NP0), X7R Initial Value x 0.3 Z5U, Y5V Initial Value x 0.1 Measuring Conditions Vibration Frequency 10-2000 Hz Maximum Acceleration 20G Swing Width 1.5mm Test Time X, Y, Z axis for 2 hours each, total 6 hours of test
Specification Appearance: No visual defects Capacitance Variation C0G (NP0): 5% or .5pF, whichever is larger X7R: 12% Z5U: 30% Y5V: 30% Insulation Resistance C0G (NP0): Initial Value x 0.3 X7R: Initial Value x 0.3 Z5U: Initial Value x 0.1 Y5V: Initial Value x 0.1 Measuring Conditions Please refer to Figure 2 Deflection: 2mm Test Time: 30 seconds
RESISTANCE TO SOLDER HEAT
Specification Appearance: No serious defects, <25% leaching of either end terminal Capacitance Variation C0G (NP0): 2.5% or 2.5pF, whichever is greater X7R: 7.5% Z5U: 20% Y5V: 20% Q, Tan Delta To meet initial requirement Insulation Resistance To meet initial requirement Dielectric Strength No problem observed Measuring Conditions Dip device in eutectic solder at 260C, for 1 minute. Store at room temperature for 48 hours (24 hours for C0G (NP0)) before measuring electrical parameters. Part sizes larger than 3.20mm x 2.49mm are reheated at 150C for 30 5 seconds before performing test.
SOLDERABILITY
Specification 95% of each termination end should be covered with fresh solder Measuring Conditions Dip device in eutectic solder at 230 5C for 2 .5 seconds
24
MIL-PRF-55681/Chips
Part Number Example
MILITARY DESIGNATION PER MIL-PRF-55681
Part Number Example
L W D t
(example)
CDR01
BP
101
B
K
S
M
MIL Style Voltage-temperature Limits Capacitance
T
Rated Voltage Capacitance Tolerance Termination Finish Failure Rate
MIL Style: CDR01, CDR02, CDR03, CDR04, CDR05, CDR06 Voltage Temperature Limits: BP = 0 30 ppm/C without voltage; 0 30 ppm/C with rated voltage from -55C to +125C BX = 15% without voltage; +15 -25% with rated voltage from -55C to +125C Capacitance: Two digit figures followed by multiplier (number of zeros to be added) e.g., 101 = 100 pF Rated Voltage: A = 50V, B = 100V Capacitance Tolerance: J 5%, K 10%, M 20%
Termination Finish: M = Palladium Silver N = Silver Nickel Gold S = Solder-coated
U = Base Metallization/Barrier Metal/Solder Coated* W = Base Metallization/Barrier Metal/Tinned (Tin or Tin/ Lead Alloy)
*Solder shall have a melting point of 200C or less. Failure Rate Level: M = 1.0%, P = .1%, R = .01%, S = .001% Packaging: Bulk is standard packaging. Tape and reel per RS481 is available upon request.
CROSS REFERENCE: AVX/MIL-PRF-55681/CDR01 THRU CDR06*
Per MIL-PRF-55681 CDR01 CDR02 CDR03 CDR04 CDR05 CDR06 AVX Style 0805 1805 1808 1812 1825 2225 Length (L) .080 .015 .180 .015 .180 .015 .180 .015 .180 +.020 -.015 .225 .020 Width (W) .050 .015 .050 .015 .080 .018 .125 .015 .250 +.020 -.015 .250 .020 Thickness (T) Max. Min. .055 .020 .055 .020 .080 .020 .080 .020 .080 .080 .020 .020 D Max. -- -- -- -- -- -- Min. .030 -- -- -- -- -- Termination Band (t) Max. Min. -- .010 .030 .010 .030 .010 .030 .010 .030 .030 .010 .010
*For CDR11, 12, 13, and 14 see AVX Microwave Chip Capacitor Catalog
25
MIL-PRF-55681/Chips
Military Part Number Identification CDR01 thru CDR06
CDR01 thru CDR06 to MIL-PRF-55681
Military Type Designation Capacitance in pF Rated temperature WVDC Capacitance and voltagetolerance temperature limits Military Type Designation Capacitance in pF Rated temperature WVDC Capacitance and voltagetolerance temperature limits
AVX Style 0805/CDR01
CDR01BP100B--CDR01BP120B--CDR01BP150B--CDR01BP180B--CDR01BP220B--CDR01BP270B--CDR01BP330B--CDR01BP390B--CDR01BP470B--CDR01BP560B--CDR01BP680B--CDR01BP820B--CDR01BP101B--CDR01B--121B--CDR01B--151B--CDR01B--181B--CDR01BX221B--CDR01BX271B--CDR01BX331B--CDR01BX391B--CDR01BX471B--CDR01BX561B--CDR01BX681B--CDR01BX821B--CDR01BX102B--CDR01BX122B--CDR01BX152B--CDR01BX182B--CDR01BX222B--CDR01BX272B--CDR01BX332B--CDR01BX392A--CDR01BX472A--10 12 15 18 22 27 33 39 47 56 68 82 100 120 150 180 220 270 330 390 470 560 680 820 1000 1200 1500 1800 2200 2700 3300 3900 4700 J,K J J,K J J,K J J,K J J,K J J,K J J,K J,K J,K J,K K,M K K,M K K,M K K,M K K,M K K,M K K,M K K,M K K,M BP BP BP BP BP BP BP BP BP BP BP BP BP BP,BX BP,BX BP,BX BX BX BX BX BX BX BX BX BX BX BX BX BX BX BX BX BX 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 50 50
AVX Style 1808/CDR03
CDR03BP331B--CDR03BP391B--CDR03BP471B--CDR03BP561B--CDR03BP681B--CDR03BP821B-CDR03BP102B--CDR03BX123B-CDR03BX153B--CDR03BX183B--CDR03BX223B--CDR03BX273B--CDR03BX333B--CDR03BX393A--CDR03BX473A--CDR03BX563A--CDR03BX683A--330 390 470 560 680 820 1000 12,000 15,000 18,000 22,000 27,000 33,000 39,000 47,000 56,000 68,000 J,K J J,K J J,K J J,K K K,M K K,M K K,M K K,M K K,M BP BP BP BP BP BP BP BX BX BX BX BX BX BX BX BX BX 100 100 100 100 100 100 100 100 100 100 100 100 100 50 50 50 50
AVX Style 1812/CDR04
CDR04BP122B--CDR04BP152B--CDR04BP182B--CDR04BP222B--CDR04BP272B--CDR04BP332B--CDR04BX393B--CDR04BX473B--CDR04BX563B--CDR04BX823A--CDR04BX104A--CDR04BX124A--CDR04BX154A--CDR04BX184A--1200 1500 1800 2200 2700 3300 39,000 47,000 56,000 82,000 100,000 120,000 150,000 180,000 J J,K J J,K J J,K K K,M K K K,M K K,M K BP BP BP BP BP BP BX BX BX BX BX BX BX BX 100 100 100 100 100 100 100 100 100 50 50 50 50 50
AVX Style 1805/CDR02
CDR02BP221B--CDR02BP271B--CDR02BX392B--CDR02BX472B--CDR02BX562B--CDR02BX682B--CDR02BX822B--CDR02BX103B--CDR02BX123A--CDR02BX153A--CDR02BX183A--CDR02BX223A--220 270 3900 4700 5600 6800 8200 10,000 12,000 15,000 18,000 22,000 J,K J K K,M K K,M K K,M K K,M K K,M BP BP BX BX BX BX BX BX BX BX BX BX 100 100 100 100 100 100 100 100 50 50 50 50
AVX Style 1825/CDR05
CDR05BP392B--CDR05BP472B--CDR05BP562B--CDR05BX683B--CDR05BX823B--CDR05BX104B--CDR05BX124B--CDR05BX154B--CDR05BX224A--CDR05BX274A--CDR05BX334A--3900 4700 5600 68,000 82,000 100,000 120,000 150,000 220,000 270,000 330,000 J,K J,K J,K K,M K K,M K K,M K,M K K,M BP BP BP BX BX BX BX BX BX BX BX 100 100 100 100 100 100 100 100 50 50 50
Add appropriate failure rate Add appropriate termination finish Capacitance Tolerance
AVX Style 2225/CDR06
CDR06BP682B--CDR06BP822B--CDR06BP103B--CDR06BX394A--CDR06BX474A--6800 8200 10,000 390,000 470,000 J,K J,K J,K K K,M BP BP BP BX BX 100 100 100 50 50
Add appropriate failure rate Add appropriate termination finish Capacitance Tolerance
26
MIL-PRF-55681/Chips
Military Part Number Identification CDR31 thru CDR35
MILITARY DESIGNATION PER MIL-PRF-55681
Part Number Example
L W D t
(example)
CDR31
BP
101
B
K
S
M
MIL Style Voltage-temperature Limits
T
Capacitance Rated Voltage Capacitance Tolerance Termination Finish Failure Rate
MIL Style: CDR31, CDR32, CDR33, CDR34, CDR35 Voltage Temperature Limits: BP = 0 30 ppm/C without voltage; 0 30 ppm/C with rated voltage from -55C to +125C BX = 15% without voltage; +15 -25% with rated voltage from -55C to +125C Capacitance: Two digit figures followed by multiplier (number of zeros to be added) e.g., 101 = 100 pF Rated Voltage: A = 50V, B = 100V Capacitance Tolerance: C .25 pF, D .5 pF, F 1% J 5%, K 10%, M 20%
Termination Finish: M = Palladium Silver N = Silver Nickel Gold S = Solder-coated
U = Base Metallization/Barrier Metal/Solder Coated* W = Base Metallization/Barrier Metal/Tinned (Tin or Tin/ Lead Alloy)
*Solder shall have a melting point of 200C or less. Failure Rate Level: M = 1.0%, P = .1%, R = .01%, S = .001% Packaging: Bulk is standard packaging. Tape and reel per RS481 is available upon request.
CROSS REFERENCE: AVX/MIL-PRF-55681/CDR31 THRU CDR35
Per MIL-PRF-55681 (Metric Sizes) CDR31 CDR32 CDR33 CDR34 CDR35 AVX Style 0805 1206 1210 1812 1825 Length (L) (mm) 2.00 3.20 3.20 4.50 4.50 Width (W) (mm) 1.25 1.60 2.50 3.20 6.40 Thickness (T) Max. (mm) 1.3 1.3 1.5 1.5 1.5 D Min. (mm) .50 -- -- -- -- Termination Band (t) Max. (mm) Min. (mm) .70 .30 .70 .30 .70 .30 .70 .30 .70 .30
27
MIL-PRF-55681/Chips
Military Part Number Identification CDR31
CDR31 to MIL-PRF-55681/7
Military Type Designation 1 / Capacitance in pF Rated temperature WVDC Capacitance and voltagetolerance temperature limits Military Type Designation 1 / Capacitance in pF Rated temperature WVDC Capacitance and voltagetolerance temperature limits
AVX Style 0805/CDR31 (BP)
CDR31BP1R0B--CDR31BP1R1B--CDR31BP1R2B--CDR31BP1R3B--CDR31BP1R5B--CDR31BP1R6B--CDR31BP1R8B--CDR31BP2R0B--CDR31BP2R2B--CDR31BP2R4B--CDR31BP2R7B--CDR31BP3R0B--CDR31BP3R3B--CDR31BP3R6B--CDR31BP3R9B--CDR31BP4R3B--CDR31BP4R7B--CDR31BP5R1B--CDR31BP5R6B--CDR31BP6R2B--CDR31BP6R8B--CDR31BP7R5B--CDR31BP8R2B--CDR31BP9R1B--CDR31BP100B--CDR31BP110B--CDR31BP120B--CDR31BP130B--CDR31BP150B--CDR31BP160B--CDR31BP180B--CDR31BP200B--CDR31BP220B--CDR31BP240B--CDR31BP270B--CDR31BP300B--CDR31BP330B--CDR31BP360B--CDR31BP390B--CDR31BP430B--CDR31BP470B--CDR31BP510B--CDR31BP560B--CDR31BP620B--CDR31BP680B--CDR31BP750B--CDR31BP820B--CDR31BP910B--1.0 1.1 1.2 1.3 1.5 1.6 1.8 2.0 2.2 2.4 2.7 3.0 3.3 3.6 3.9 4.3 4.7 5.1 5.6 6.2 6.8 7.5 8.2 9.1 10 11 12 13 15 16 18 20 22 24 27 30 33 36 39 43 47 51 56 62 68 75 82 91 C C C C C C C C C C C,D C,D C,D C,D C,D C,D C,D C,D C,D C,D C,D C,D C,D C,D J,K J,K J,K J,K J,K J,K J,K J,K J,K J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K BP BP BP BP BP BP BP BP BP BP BP BP BP BP BP BP BP BP BP BP BP BP BP BP BP BP BP BP BP BP BP BP BP BP BP BP BP BP BP BP BP BP BP BP BP BP BP BP 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100
AVX Style 0805/CDR31 (BP) cont'd
CDR31BP101B--CDR31BP111B--CDR31BP121B--CDR31BP131B--CDR31BP151B--CDR31BP161B--CDR31BP181B--CDR31BP201B--CDR31BP221B--CDR31BP241B--CDR31BP271B--CDR31BP301B--CDR31BP331B--CDR31BP361B--CDR31BP391B--CDR31BP431B--CDR31BP471B--CDR31BP511A--CDR31BP561A--CDR31BP621A--CDR31BP681A--100 110 120 130 150 160 180 200 220 240 270 300 330 360 390 430 470 510 560 620 680 F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K BP BP BP BP BP BP BP BP BP BP BP BP BP BP BP BP BP BP BP BP BP 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 50 50 50 50
AVX Style 0805/CDR31 (BX)
CDR31BX471B--CDR31BX561B--CDR31BX681B--CDR31BX821B--CDR31BX102B--CDR31BX122B--CDR31BX152B--CDR31BX182B--CDR31BX222B--CDR31BX272B--CDR31BX332B--CDR31BX392B--CDR31BX472B--CDR31BX562A--CDR31BX682A--CDR31BX822A--CDR31BX103A--CDR31BX123A--CDR31BX153A--CDR31BX183A--470 560 680 820 1,000 1,200 1,500 1,800 2,200 2,700 3,300 3,900 4,700 5,600 6,800 8,200 10,000 12,000 15,000 18,000 K,M K,M K,M K,M K,M K,M K,M K,M K,M K,M K,M K,M K,M K,M K,M K,M K,M K,M K,M K,M BX BX BX BX BX BX BX BX BX BX BX BX BX BX BX BX BX BX BX BX 100 100 100 100 100 100 100 100 100 100 100 100 100 50 50 50 50 50 50 50
Add appropriate failure rate Add appropriate termination finish Capacitance Tolerance 1 / The complete part number will include additional symbols to indicate capacitance tolerance, termination and failure rate level.
Add appropriate failure rate Add appropriate termination finish Capacitance Tolerance
28
MIL-PRF-55681/Chips
Military Part Number Identification CDR32
CDR32 to MIL-PRF-55681/8
Military Type Designation 1 / Capacitance in pF Rated temperature WVDC Capacitance and voltagetolerance temperature limits Military Type Designation 1 / Capacitance in pF Rated temperature WVDC Capacitance and voltagetolerance temperature limits
AVX Style 1206/CDR32 (BP)
CDR32BP1R0B--CDR32BP1R1B--CDR32BP1R2B--CDR32BP1R3B--CDR32BP1R5B--CDR32BP1R6B--CDR32BP1R8B--CDR32BP2R0B--CDR32BP2R2B--CDR32BP2R4B--CDR32BP2R7B--CDR32BP3R0B--CDR32BP3R3B--CDR32BP3R6B--CDR32BP3R9B--CDR32BP4R3B--CDR32BP4R7B--CDR32BP5R1B--CDR32BP5R6B--CDR32BP6R2B--CDR32BP6R8B--CDR32BP7R5B--CDR32BP8R2B--CDR32BP9R1B--CDR32BP100B--CDR32BP110B--CDR32BP120B--CDR32BP130B--CDR32BP150B--CDR32BP160B--CDR32BP180B--CDR32BP200B--CDR32BP220B--CDR32BP240B--CDR32BP270B--CDR32BP300B--CDR32BP330B--CDR32BP360B--CDR32BP390B--CDR32BP430B--CDR32BP470B--CDR32BP510B--CDR32BP560B--CDR32BP620B--CDR32BP680B--CDR32BP750B--CDR32BP820B--CDR32BP910B--1.0 1.1 1.2 1.3 1.5 1.6 1.8 2.0 2.2 2.4 2.7 3.0 3.3 3.6 3.9 4.3 4.7 5.1 5.6 6.2 6.8 7.5 8.2 9.1 10 11 12 13 15 16 18 20 22 24 27 30 33 36 39 43 47 51 56 62 68 75 82 91 C C C C C C C C C C C,D C,D C,D C,D C,D C,D C,D C,D C,D C,D C,D C,D C,D C,D J,K J,K J,K J,K J,K J,K J,K J,K J,K J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K BP BP BP BP BP BP BP BP BP BP BP BP BP BP BP BP BP BP BP BP BP BP BP BP BP BP BP BP BP BP BP BP BP BP BP BP BP BP BP BP BP BP BP BP BP BP BP BP 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100
AVX Style 1206/CDR32 (BP) cont'd
CDR32BP101B--CDR32BP111B--CDR32BP121B--CDR32BP131B--CDR32BP151B--CDR32BP161B--CDR32BP181B--CDR32BP201B--CDR32BP221B--CDR32BP241B--CDR32BP271B--CDR32BP301B--CDR32BP331B--CDR32BP361B--CDR32BP391B--CDR32BP431B--CDR32BP471B--CDR32BP511B--CDR32BP561B--CDR32BP621B--CDR32BP681B--CDR32BP751B--CDR32BP821B--CDR32BP911B--CDR32BP102B--CDR32BP112A--CDR32BP122A--CDR32BP132A--CDR32BP152A--CDR32BP162A--CDR32BP182A--CDR32BP202A--CDR32BP222A--100 110 120 130 150 160 180 200 220 240 270 300 330 360 390 430 470 510 560 620 680 750 820 910 1,000 1,100 1,200 1,300 1,500 1,600 1,800 2,000 2,200 F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K BP BP BP BP BP BP BP BP BP BP BP BP BP BP BP BP BP BP BP BP BP BP BP BP BP BP BP BP BP BP BP BP BP 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 50 50 50 50 50 50 50 50
AVX Style 1206/CDR32 (BX)
CDR32BX472B--CDR32BX562B--CDR32BX682B--CDR32BX822B--CDR32BX103B--CDR32BX123B--CDR32BX153B--CDR32BX183A--CDR32BX223A--CDR32BX273A--CDR32BX333A--CDR32BX393A--4,700 5,600 6,800 8,200 10,000 12,000 15,000 18,000 22,000 27,000 33,000 39,000 K,M K,M K,M K,M K,M K,M K,M K,M K,M K,M K,M K,M BX BX BX BX BX BX BX BX BX BX BX BX 100 100 100 100 100 100 100 50 50 50 50 50
Add appropriate failure rate Add appropriate termination finish Capacitance Tolerance
Add appropriate failure rate Add appropriate termination finish Capacitance Tolerance 1 / The complete part number will include additional symbols to indicate capacitance tolerance, termination and failure rate level.
29
MIL-PRF-55681/Chips
Military Part Number Identification CDR33/34/35
CDR33/34/35 to MIL-PRF-55681/9/10/11
Military Type Designation 1 / Capacitance in pF Rated temperature WVDC Capacitance and voltagetolerance temperature limits Military Type Designation 1 / Capacitance in pF Rated temperature WVDC Capacitance and voltagetolerance temperature limits
AVX Style 1210/CDR33 (BP)
CDR33BP102B--CDR33BP112B--CDR33BP122B--CDR33BP132B--CDR33BP152B--CDR33BP162B--CDR33BP182B--CDR33BP202B--CDR33BP222B--CDR33BP242A--CDR33BP272A--CDR33BP302A--CDR33BP332A--1,000 1,100 1,200 1,300 1,500 1,600 1,800 2,000 2,200 2,400 2,700 3,000 3,300 F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K BP BP BP BP BP BP BP BP BP BP BP BP BP 100 100 100 100 100 100 100 100 100 50 50 50 50
AVX Style 1812/CDR34 (BX)
CDR34BX273B--CDR34BX333B--CDR34BX393B--CDR34BX473B--CDR34BX563B--CDR34BX104A--CDR34BX124A--CDR34BX154A--CDR34BX184A--27,000 33,000 39,000 47,000 56,000 100,000 120,000 150,000 180,000 K,M K,M K,M K,M K,M K,M K,M K,M K,M BX BX BX BX BX BX BX BX BX 100 100 100 100 100 50 50 50 50
AVX Style 1825/CDR35 (BP)
CDR35BP472B--CDR35BP512B--CDR35BP562B--CDR35BP622B--CDR35BP682B--CDR35BP752B--CDR35BP822B--CDR35BP912B--CDR35BP103B--CDR35BP113A--CDR35BP123A--CDR35BP133A--CDR35BP153A--CDR35BP163A--CDR35BP183A--CDR35BP203A--CDR35BP223A--4,700 5,100 5,600 6,200 6,800 7,500 8,200 9,100 10,000 11,000 12,000 13,000 15,000 16,000 18,000 20,000 22,000 F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K BP BP BP BP BP BP BP BP BP BP BP BP BP BP BP BP BP 100 100 100 100 100 100 100 100 100 50 50 50 50 50 50 50 50
AVX Style 1210/CDR33 (BX)
CDR33BX153B--CDR33BX183B--CDR33BX223B--CDR33BX273B--CDR33BX393A--CDR33BX473A--CDR33BX563A--CDR33BX683A--CDR33BX823A--CDR33BX104A--15,000 18,000 22,000 27,000 39,000 47,000 56,000 68,000 82,000 100,000 K,M K,M K,M K,M K,M K,M K,M K,M K,M K,M BX BX BX BX BX BX BX BX BX BX 100 100 100 100 50 50 50 50 50 50
AVX Style 1812/CDR34 (BP)
CDR34BP222B--CDR34BP242B--CDR34BP272B--CDR34BP302B--CDR34BP332B--CDR34BP362B--CDR34BP392B--CDR34BP432B--CDR34BP472B--CDR34BP512A--CDR34BP562A--CDR34BP622A--CDR34BP682A--CDR34BP752A--CDR34BP822A--CDR34BP912A--CDR34BP103A--2,200 2,400 2,700 3,000 3,300 3,600 3,900 4,300 4,700 5,100 5,600 6,200 6,800 7,500 8,200 9,100 10,000 F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K BP BP BP BP BP BP BP BP BP BP BP BP BP BP BP BP BP 100 100 100 100 100 100 100 100 100 50 50 50 50 50 50 50 50
AVX Style 1825/CDR35 (BX)
CDR35BX563B--CDR35BX683B--CDR35BX823B--CDR35BX104B--CDR35BX124B--CDR35BX154B--CDR35BX184A--CDR35BX224A--CDR35BX274A--CDR35BX334A--CDR35BX394A--CDR35BX474A--56,000 68,000 82,000 100,000 120,000 150,000 180,000 220,000 270,000 330,000 390,000 470,000 K,M K,M K,M K,M K,M K,M K,M K,M K,M K,M K,M K,M BX BX BX BX BX BX BX BX BX BX BX BX 100 100 100 100 100 100 50 50 50 50 50 50
Add appropriate failure rate Add appropriate failure rate Add appropriate termination finish Add appropriate termination finish Capacitance Tolerance Capacitance Tolerance 1 / The complete part number will include additional symbols to indicate capacitance tolerance, termination and failure rate level.
30
European Detail Specifications CECC 32 101-801/Chips
Standard European Ceramic Chip Capacitors
PART NUMBER (example)
0805
Size (L" x W")
5
Voltage 50V = 5 100V = 1 200V = 2
C
Dielectric 1B CG = A 2R1 = C 2F4 = G
103
Capacitance Code
M
T
T
2
Marking Packaging 2 = 7" Reel 4 = 13" Reel
A
Special Code A = Std. Product
Capacitance Specification Terminations Tolerance CECC32101-801 T = Plated Ni See Dielectrics and Sn C0G, X7R, Y5V
RANGE OF APPROVED COMPONENTS
Case Size 1BCG 0603 0805 1206 1210 1808 1812 2220 2R1 0603 0805 1206 1210 1808 1812 2220 2F4 0805 1206 1210 1808 1812 2220 2F4 2F4 2F4 2F4 2F4 2F4 10pF - 100nF 10pF - 330nF 10pF - 470nF 10pF - 560nF 10pF - 1.8F 10pF - 2.2F 2R1 2R1 2R1 2R1 2R1 2R1 2R1 10pF - 6.8nF 10pF - 33nF 10pF - 100nF 10pF - 150nF 10pF - 270nF 10pF - 470nF 10pF - 1.2F 10pF - 6.8nF 10pF - 18nF 10pF - 68nF 10pF - 100nF 10pF - 180nF 10pF - 330nF 10pF - 680nF 10pF - 1.2nF 10pF - 3.3nF 10pF - 18nF 10pF - 27nF 10pF - 47nF 10pF - 100nF 10pF - 220nF Dielectric Type 1B CG 1B CG 1B CG 1B CG 1B CG 1B CG 1B CG 50V 0.47pF - 150pF 0.47pF - 560pF 0.47pF - 3.3nF 0.47pF - 4.7nF 0.47pF - 6.8nF 0.47pF - 15nF 0.47pF - 39nF Voltage and Capacitance Range 100V 0.47pF - 120pF 0.47pF - 560pF 0.47pF - 3.3nF 0.47pF - 4.7nF 0.47pF - 6.8nF 0.47pF - 15nF 0.47pF - 39nF 200V 0.47pF - 100pF 0.47pF - 330pF 0.47pF - 1.5nF 0.47pF - 2.7nF 0.47pF - 4.7nF 0.47pF - 10nF 0.47pF - 15nF
31
Packaging of Chip Components
Automatic Insertion Packaging
TAPE & REEL QUANTITIES
All tape and reel specifications are in compliance with RS481.
8mm Paper or Embossed Carrier Embossed Only Paper Only Qty. per Reel/7" Reel Qty. per Reel/13" Reel
(1)
12mm
0805, 1005, 1206, 1210 0504, 0907 0402, 0603 2,000 or 4,000 (1) 10,000 3,000 10,000 1,000 4,000 1505, 1805, 1808 1812, 1825 2220, 2225
Dependent on chip thickness. Low profile chips shown on page 27 are 5,000 per reel for 7" reel. 0402 size chips are 10,000 per 7" reels and are not available on 13" reels. For 3640 size chip contact factory for quantity per reel.
REEL DIMENSIONS
Tape Size(1) 8mm
A Max.
B* Min.
C
D* Min.
N Min.
W1 8.4 +1.0 -0.0 (.331 +.060 ) -0.0
W2 Max. 14.4 (.567)
W3 7.9 Min. (.311) 10.9 Max. (.429) 11.9 Min. (.469) 15.4 Max. (.607)
330 (12.992) 12mm
1.5 (.059)
13.00.20 (.512.008)
20.2 (.795)
50 (1.969) 12.4 +2.0 -0.0 +.076 (.488 -0.0 ) 18.4 (.724)
Metric dimensions will govern. English measurements rounded and for reference only. (1) For tape sizes 16mm and 24mm (used with chip size 3640) consult EIA RS-481 latest revision.
32
Embossed Carrier Configuration
8 & 12mm Tape Only
8 & 12mm Embossed Tape Metric Dimensions Will Govern
CONSTANT DIMENSIONS
Tape Size 8mm and 12mm D0 8.4 (.059
+0.10 -0.0 +.004 -0.0
E )
P0
P2
T Max. 0.600 (.024)
T1 0.10 (.004) Max.
G1 0.75 (.030) Min. See Note 3
G2 0.75 (.030) Min. See Note 4
1.75 0.10 4.0 0.10 2.0 0.05 (.069 .004) (.157 .004) (.079 .002)
VARIABLE DIMENSIONS
Tape Size B1 D1 Max. Min. See Note 6 See Note 5 4.55 (.179) 8.2 (.323) 4.55 (.179) 8.2 (.323) 1.0 (.039) 1.5 (.059) 1.0 (.039) 1.5 (.059) F P1 R Min. See Note 2 25 (.984) 30 (1.181) 25 (.984) 30 (1.181) T2 W A0 B0 K0
8mm
3.5 0.05 4.0 0.10 (.138 .002) (.157 .004) 5.5 0.05 4.0 0.10 (.217 .002) (.157 .004) 3.5 0.05 2.0 0.10 (.138 .002) 0.79 .004 5.5 0.05 8.0 0.10 (.217 .002) (.315 .004)
2.5 Max (.098) 6.5 Max. (.256) 2.5 Max. (.098) 6.5 Max. (.256)
8.0 +0.3 -0.1 (.315 +.012 ) -.004 12.0 .30 (.472 .012)
-0.1 8.0 +0.3 (.315 +.012 ) -.004
See Note 1
12mm 8mm 1/2 Pitch 12mm Double Pitch
See Note 1
See Note 1
12.0 .30 (.472 .012)
See Note 1
NOTES: 1. A0, B0, and K0 are determined by the max. dimensions to the ends of the terminals extending from the component body and/or the body dimensions of the component. The clearance between the end of the terminals or body of the component to the sides and depth of the cavity (A0, B0, and K0) must be within 0.05 mm (.002) min. and 0.50 mm (.020) max. The clearance allowed must also prevent rotation of the component within the cavity of not more than 20 degrees (see sketches C & D). 2. Tape with components shall pass around radius "R" without damage. The minimum trailer length (Note 2 Fig. 3) may require additional length to provide R min. for 12 mm embossed tape for reels with hub diameters approaching N min. (Table 4). 3. G1 dimension is the flat area from the edge of the sprocket hole to either the outward deformation of the carrier tape between the embossed cavities or to the edge of the cavity whichever is less. 4. G2 dimension is the flat area from the edge of the carrier tape opposite the sprocket holes to either the outward deformation of the carrier tape between the embossed cavity or to the edge of the cavity whichever is less. 5. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment location and hole location shall be applied independent of each other. 6. B1 dimension is a reference dimension for tape feeder clearance only.
33
Paper Carrier Configuration
8 & 12mm Tape Only
8 & 12mm Paper Tape Metric Dimensions Will Govern
CONSTANT DIMENSIONS
Tape Size 8mm and 12mm D0 1.5 (.059
+0.1 -0.0 +.004 -.000
E ) 1.75 0.10 (.069 .004)
P0
P2
T1 0.10 (.004) Max.
G1 0.75 (.030) Min.
G2 0.75 (.030) Min.
R MIN. 25 (.984) See Note 2
4.0 0.10 2.0 0.05 (.157 .004) (.079 .002)
VARIABLE DIMENSIONS
Tape Size 8mm P1 4.0 0.10 (.157 .004) 4.0 .010 (.157 .004) 2.0 0.10 (.079 .004) F 3.5 0.05 (.138 .002) 5.5 0.05 (.217 .002) 3.5 0.05 (.138 .002) W
-0.1 8.0 +0.3 (.315 +.012 ) -.004
A0 B0 See Note 1
T See Note 3
12mm 8mm 1/2 Pitch 12mm Double Pitch
12.0 0.3 (.472 .012) 8.0 +0.3 -0.1 (.315 +.012 ) -.004
8.0 0.10 (.315 .004)
5.5 0.05 (.217 .002)
12.0 0.3 (.472 .012)
NOTES: 1. A0, B0, and T are determined by the max. dimensions to the ends of the terminals extending from the component body and/or the body dimensions of the component. The clearance between the ends of the terminals or body of the component to the sides and depth of the cavity (A0, B0, and T) must be within 0.05 mm (.002) min. and 0.50 mm (.020) max. The clearance allowed must also prevent rotation of the component within the cavity of not more than 20 degrees (see sketches A & B). 2. Tape with components shall pass around radius "R" without damage. 3. 1.1 mm (.043) Base Tape and 1.6 mm (.063) Max. for Non-Paper Base Compositions.
Bar Code Labeling Standard
AVX bar code labeling is available and follows latest version of EIA-556-A.
34
Bulk Case Packaging
BENEFITS
* Easier handling * Smaller packaging volume
(1/20 of T/R packaging)
BULK FEEDER
* Easier inventory control * Flexibility * Recyclable
Case
Cassette Gate
CASE DIMENSIONS
Shutter Slider 12mm 36mm Expanded Drawing 110mm Attachment Base
Shooter
Mounter Head Chips
CASE QUANTITIES
Part Size Qty. (pcs / cassette) 0402 80,000 0603 15,000 0805 10,000 (T=0.6mm) 5,000 (T0.6mm)
35
General Description
Basic Construction - A multilayer ceramic (MLC) capacitor is a monolithic block of ceramic containing two sets of offset, interleaved planar electrodes that extend to two opposite surfaces of the ceramic dielectric. This simple structure requires a considerable amount of sophistication, both in material and manufacture, to produce it in the quality and quantities needed in today's electronic equipment.
Ceramic Layer
Electrode End Terminations
Terminated Edge
Terminated Edge
Margin
Electrodes
Formulations - Multilayer ceramic capacitors are available in both Class 1 and Class 2 formulations. Temperature compensating formulation are Class 1 and temperature stable and general application formulations are classified as Class 2. Class 1 - Class 1 capacitors or temperature compensating capacitors are usually made from mixtures of titanates where barium titanate is normally not a major part of the mix. They have predictable temperature coefficients and in general, do not have an aging characteristic. Thus they are the most stable capacitor available. The most popular Class 1 multilayer ceramic capacitors are C0G (NP0) temperature compensating capacitors (negative-positive 0 ppm/C).
Class 2 - EIA Class 2 capacitors typically are based on the chemistry of barium titanate and provide a wide range of capacitance values and temperature stability. The most commonly used Class 2 dielectrics are X7R and Y5V. The X7R provides intermediate capacitance values which vary only 15% over the temperature range of -55C to 125C. It finds applications where stability over a wide temperature range is required. The Y5V provides the highest capacitance values and is used in applications where limited temperature changes are expected. The capacitance value for Y5V can vary from 22% to -82% over the -30C to 85C temperature range. The Z5U dielectric is between X7R and Y5V in both stability and capacitance range. All Class 2 capacitors vary in capacitance value under the influence of temperature, operating voltage (both AC and DC), and frequency. For additional information on performance changes with operating conditions, consult AVX's software, SpiCap.
36
General Description
Effects of Voltage - Variations in voltage have little effect on Class 1 dielectric but does affect the capacitance and dissipation factor of Class 2 dielectrics. The application of DC voltage reduces both the capacitance and dissipation factor while the application of an AC voltage within a reasonable range tends to increase both capacitance and dissipation factor readings. If a high enough AC voltage is applied, eventually it will reduce capacitance just as a DC voltage will. Figure 2 shows the effects of AC voltage.
Cap. Change vs. D.C. Volts AVX X7R T.C.
Capacitance Change Percent 2.5 0 -2.5 -5 -7.5 -10 25% 50% 75% Percent Rated Volts 100%
Cap. Change vs. A.C. Volts AVX X7R T.C.
Capacitance Change Percent 50 40 30 20
Figure 4
Typical Cap. Change vs. Temperature AVX X7R T.C.
Capacitance Change Percent +20 +10 0VDC 0 -10 -20 -30 -55 -35 -15 +5 +25 +45 +65 +85 +105 +125 RVDC
10 0 12.5 25 37.5 Volts AC at 1.0 KHz 50
Figure 2
Capacitor specifications specify the AC voltage at which to measure (normally 0.5 or 1 VAC) and application of the wrong voltage can cause spurious readings. Figure 3 gives the voltage coefficient of dissipation factor for various AC voltages at 1 kilohertz. Applications of different frequencies will affect the percentage changes versus voltages.
Temperature Degrees Centigrade
Figure 5
D.F. vs. A.C. Measurement Volts AVX X7R T.C.
10.0 Dissipation Factor Percent Curve 1 - 100 VDC Rated Capacitor 8.0 Curve 2 - 50 VDC Rated Capacitor Curve 3 - 25 VDC Rated Capacitor 6.0 4.0 2.0 0 .5 1.0 1.5 2.0 2.5 AC Measurement Volts at 1.0 KHz Curve 1 Curve 3 Curve 2
Figure 3
The effect of the application of DC voltage is shown in Figure 4. The voltage coefficient is more pronounced for higher K dielectrics. These figures are shown for room temperature conditions. The combination characteristic known as voltage temperature limits which shows the effects of rated voltage over the operating temperature range is shown in Figure 5 for the military BX characteristic.
Effects of Time - Class 2 ceramic capacitors change capacitance and dissipation factor with time as well as temperature, voltage and frequency. This change with time is known as aging. Aging is caused by a gradual re-alignment of the crystalline structure of the ceramic and produces an exponential loss in capacitance and decrease in dissipation factor versus time. A typical curve of aging rate for semistable ceramics is shown in Figure 6. If a Class 2 ceramic capacitor that has been sitting on the shelf for a period of time, is heated above its curie point, (125C for 4 hours or 150C for 12 hour will suffice) the part will de-age and return to its initial capacitance and dissipation factor readings. Because the capacitance changes rapidly, immediately after de-aging, the basic capacitance measurements are normally referred to a time period sometime after the de-aging process. Various manufacturers use different time bases but the most popular one is one day or twenty-four hours after "last heat." Change in the aging curve can be caused by the application of voltage and other stresses. The possible changes in capacitance due to de-aging by heating the unit explain why capacitance changes are allowed after test, such as temperature cycling, moisture resistance, etc., in MIL specs. The application of high voltages such as dielectric withstanding voltages also
37
General Description
tends to de-age capacitors and is why re-reading of capacitance after 12 or 24 hours is allowed in military specifications after dielectric strength tests have been performed. Effects of Mechanical Stress - High "K" dielectric ceramic capacitors exhibit some low level piezoelectric reactions under mechanical stress. As a general statement, the piezoelectric output is higher, the higher the dielectric constant of the ceramic. It is desirable to investigate this effect before using high "K" dielectrics as coupling capacitors in extremely low level applications. Reliability - Historically ceramic capacitors have been one of the most reliable types of capacitors in use today. The approximate formula for the reliability of a ceramic capacitor is:
Lo = Lt Vt Vo
X
Typical Curve of Aging Rate X7R Dielectric
+1.5 0 Capacitance Change Percent -1.5
Tt To
Y
-3.0 -4.5
-6.0 -7.5 1 10 100 1000 10,000 100,000 Hours
where Lo = operating life Lt = test life Vt = test voltage Vo = operating voltage
Tt = test temperature and To = operating temperature in C X,Y = see text
Historically for ceramic capacitors exponent X has been considered as 3. The exponent Y for temperature effects typically tends to run about 8. A capacitor is a component which is capable of storing electrical energy. It consists of two conductive plates (electrodes) separated by insulating material which is called the dielectric. A typical formula for determining capacitance is:
Characteristic C0G (NP0) X7R Z5U Y5V
Max. Aging Rate %/Decade None 2 3 5
Figure 6
Effects of Frequency - Frequency affects capacitance and impedance characteristics of capacitors. This effect is much more pronounced in high dielectric constant ceramic formulation that is low K formulations. AVX's SpiCap software generates impedance, ESR, series inductance, series resonant frequency and capacitance all as functions of frequency, temperature and DC bias for standard chip sizes and styles. It is available free from AVX.
C = .224 KA t
C = capacitance (picofarads) K = dielectric constant (Vacuum = 1) A = area in square inches t = separation between the plates in inches (thickness of dielectric) .224 = conversion constant (.0884 for metric system in cm) Capacitance - The standard unit of capacitance is the farad. A capacitor has a capacitance of 1 farad when 1 coulomb charges it to 1 volt. One farad is a very large unit and most capacitors have values in the micro (10-6), nano (10-9) or pico (10-12) farad level. Dielectric Constant - In the formula for capacitance given above the dielectric constant of a vacuum is arbitrarily chosen as the number 1. Dielectric constants of other materials are then compared to the dielectric constant of a vacuum. Dielectric Thickness - Capacitance is indirectly proportional to the separation between electrodes. Lower voltage requirements mean thinner dielectrics and greater capacitance per volume. Area - Capacitance is directly proportional to the area of the electrodes. Since the other variables in the equation are usually set by the performance desired, area is the easiest parameter to modify to obtain a specific capacitance within a material group.
38
General Description
Energy Stored - The energy which can be stored in a capacitor is given by the formula:
I (Ideal) I (Actual)
E = 12CV2
E = energy in joules (watts-sec) V = applied voltage C = capacitance in farads Potential Change - A capacitor is a reactive component which reacts against a change in potential across it. This is shown by the equation for the linear charge of a capacitor:
Loss Angle Phase Angle
f
IR s V
I ideal = C dV dt
where
In practice the current leads the voltage by some other phase angle due to the series resistance RS. The complement of this angle is called the loss angle and: Power Factor (P.F.) = Cos f or Sine Dissipation Factor (D.F.) = tan for small values of the tan and sine are essentially equal which has led to the common interchangeability of the two terms in the industry. Equivalent Series Resistance - The term E.S.R. or Equivalent Series Resistance combines all losses both series and parallel in a capacitor at a given frequency so that the equivalent circuit is reduced to a simple R-C series connection.
I = Current C = Capacitance dV/dt = Slope of voltage transition across capacitor Thus an infinite current would be required to instantly change the potential across a capacitor. The amount of current a capacitor can "sink" is determined by the above equation. Equivalent Circuit - A capacitor, as a practical device, exhibits not only capacitance but also resistance and inductance. A simplified schematic for the equivalent circuit is: C = Capacitance L = Inductance Rp = Parallel Resistance Rs = Series Resistance RP
E.S.R.
C
L
RS C
Dissipation Factor - The DF/PF of a capacitor tells what percent of the apparent power input will turn to heat in the capacitor. Dissipation Factor = E.S.R. = (2 fC) (E.S.R.) XC The watts loss are: Watts loss = (2 fCV2 ) (D.F.) Very low values of dissipation factor are expressed as their reciprocal for convenience. These are called the "Q" or Quality factor of capacitors. Parasitic Inductance - The parasitic inductance of capacitors is becoming more and more important in the decoupling of today's high speed digital systems. The relationship between the inductance and the ripple voltage induced on the DC voltage line can be seen from the simple inductance equation: V = L di dt
Reactance - Since the insulation resistance (Rp) is normally very high, the total impedance of a capacitor is: Z= where Z = Total Impedance R 2 + (XC - XL )2 S
Rs = Series Resistance XC = Capacitive Reactance = XL = Inductive Reactance
1 2 fC = 2 fL
The variation of a capacitor's impedance with frequency determines its effectiveness in many applications. Phase Angle - Power Factor and Dissipation Factor are often confused since they are both measures of the loss in a capacitor under AC application and are often almost identical in value. In a "perfect" capacitor the current in the capacitor will lead the voltage by 90.
39
General Description
The dt seen in current microprocessors can be as high as 0.3 A/ns, and up to 10A/ns. At 0.3 A/ns, 100pH of parasitic inductance can cause a voltage spike of 30mV. While this does not sound very drastic, with the Vcc for microprocessors decreasing at the current rate, this can be a fairly large percentage. Another important, often overlooked, reason for knowing the parasitic inductance is the calculation of the resonant frequency. This can be important for high frequency, bypass capacitors, as the resonant point will give the most signal attenuation. The resonant frequency is calculated from the simple equation: 1 fres = 2 LC Insulation Resistance - Insulation Resistance is the resistance measured across the terminals of a capacitor and consists principally of the parallel resistance R P shown in the equivalent circuit. As capacitance values and hence the area of dielectric increases, the I.R. decreases and hence the product (C x IR or RC) is often specified in ohm farads or more commonly megohm-microfarads. Leakage current
di
is determined by dividing the rated voltage by IR (Ohm's Law). Dielectric Strength - Dielectric Strength is an expression of the ability of a material to withstand an electrical stress. Although dielectric strength is ordinarily expressed in volts, it is actually dependent on the thickness of the dielectric and thus is also more generically a function of volts/mil. Dielectric Absorption - A capacitor does not discharge instantaneously upon application of a short circuit, but drains gradually after the capacitance proper has been discharged. It is common practice to measure the dielectric absorption by determining the "reappearing voltage" which appears across a capacitor at some point in time after it has been fully discharged under short circuit conditions. Corona - Corona is the ionization of air or other vapors which causes them to conduct current. It is especially prevalent in high voltage units but can occur with low voltages as well where high voltage gradients occur. The energy discharged degrades the performance of the capacitor and can in time cause catastrophic failures.
40
Surface Mounting Guide
MLC Chip Capacitors
Component Pad Design
Component pads should be designed to achieve good solder filets and minimize component movement during reflow soldering. Pad designs are given below for the most common sizes of multilayer ceramic capacitors for both wave and reflow soldering. The basis of these designs is: * Pad width equal to component width. It is permissible to decrease this to as low as 85% of component width but it is not advisable to go below this. * Pad overlap 0.5mm beneath component. * Pad extension 0.5mm beyond components for reflow and 1.0mm for wave soldering.
REFLOW SOLDERING
Case Size 0402 0603 0805 1206 1210 1808 1812 1825 2220 2225 D1
1.70 (0.07) 2.30 (0.09) 3.00 (0.12) 4.00 (0.16) 4.00 (0.16) 5.60 (0.22) 5.60 (0.22) 5.60 (0.22) 6.60 (0.26) 6.60 (0.26)
D2
0.60 (0.02) 0.80 (0.03) 1.00 (0.04) 1.00 (0.04) 1.00 (0.04) 1.00 (0.04) 1.00 (0.04)) 1.00 (0.04) 1.00 (0.04) 1.00 (0.04)
D3
0.50 (0.02) 0.70 (0.03) 1.00 (0.04) 2.00 (0.09) 2.00 (0.09) 3.60 (0.14) 3.60 (0.14) 3.60 (0.14) 4.60 (0.18) 4.60 (0.18)
D4
0.60 (0.02) 0.80 (0.03) 1.00 (0.04) 1.00 (0.04) 1.00 (0.04) 1.00 (0.04) 1.00 (0.04) 1.00 (0.04) 1.00 (0.04) 1.00 (0.04)
D5
0.50 (0.02) 0.75 (0.03) 1.25 (0.05) 1.60 (0.06) 2.50 (0.10) 2.00 (0.08) 3.00 (0.12) 6.35 (0.25) 5.00 (0.20) 6.35 (0.25)
D2
D1
D3
D4
D5
Dimensions in millimeters (inches)
41
Surface Mounting Guide
MLC Chip Capacitors
WAVE SOLDERING
D2
D1
D3
D4
Case Size 0603 0805 1206 1210
D5
D1
3.10 (0.12) 4.00 (0.15) 5.00 (0.19) 5.00 (0.19)
D2
1.20 (0.05) 1.50 (0.06) 1.50 (0.06) 1.50 (0.06)
D3
0.70 (0.03) 1.00 (0.04) 2.00 (0.09) 2.00 (0.09)
D4
1.20 (0.05) 1.50 (0.06) 1.50 (0.06) 1.50 (0.06)
D5
0.75 (0.03) 1.25 (0.05) 1.60 (0.06) 2.50 (0.10)
Dimensions in millimeters (inches)
Component Spacing
For wave soldering components, must be spaced sufficiently far apart to avoid bridging or shadowing (inability of solder to penetrate properly into small spaces). This is less important for reflow soldering but sufficient space must be allowed to enable rework should it be required.
Preheat & Soldering
The rate of preheat should not exceed 4C/second to prevent thermal shock. A better maximum figure is about 2C/second. For capacitors size 1206 and below, with a maximum thickness of 1.25mm, it is generally permissible to allow a temperature differential from preheat to soldering of 150C. In all other cases this differential should not exceed 100C. For further specific application or process advice, please consult AVX.
1.5mm (0.06) 1mm (0.04)
Cleaning
Care should be taken to ensure that the capacitors are thoroughly cleaned of flux residues especially the space beneath the capacitor. Such residues may otherwise become conductive and effectively offer a low resistance bypass to the capacitor. Ultrasonic cleaning is permissible, the recommended conditions being 8 Watts/litre at 20-45 kHz, with a process cycle of 2 minutes vapor rinse, 2 minutes immersion in the ultrasonic solvent bath and finally 2 minutes vapor rinse.
1mm (0.04)
42
Surface Mounting Guide
MLC Chip Capacitors
APPLICATION NOTES
Storage
Good solderability is maintained for at least twelve months, provided the components are stored in their "as received" packaging at less than 40C and 70% RH.
General
Surface mounting chip multilayer ceramic capacitors are designed for soldering to printed circuit boards or other substrates. The construction of the components is such that they will withstand the time/temperature profiles used in both wave and reflow soldering methods.
Solderability
Terminations to be well soldered after immersion in a 60/40 tin/lead solder bath at 235 5C for 21 seconds.
Handling
Chip multilayer ceramic capacitors should be handled with care to avoid damage or contamination from perspiration and skin oils. The use of tweezers or vacuum pick ups is strongly recommended for individual components. Bulk handling should ensure that abrasion and mechanical shock are minimized. Taped and reeled components provides the ideal medium for direct presentation to the placement machine. Any mechanical shock should be minimized during handling chip multilayer ceramic capacitors.
Leaching
Terminations will resist leaching for at least the immersion times and conditions shown below. Termination Type Nickel Barrier Solder Solder Tin/Lead/Silver Temp. C 60/40/0 2605 Immersion Time Seconds 301
Preheat Recommended Soldering Profiles
Reflow
300 250 200 150 100 50 220C to 250C Preheat Natural Cooling
Solder Temp.
It is important to avoid the possibility of thermal shock during soldering and carefully controlled preheat is therefore required. The rate of preheat should not exceed 4C/second and a target figure 2C/second is recommended. Although an 80C to 120C temperature differential is preferred, recent developments allow a temperature differential between the component surface and the soldering temperature of 150C (Maximum) for capacitors of 1210 size and below with a maximum thickness of 1.25mm. The user is cautioned that the risk of thermal shock increases as chip size or temperature differential increases.
Soldering
Mildly activated rosin fluxes are preferred. The minimum amount of solder to give a good joint should be used. Excessive solder can lead to damage from the stresses caused by the difference in coefficients of expansion between solder, chip and substrate. AVX terminations are suitable for all wave and reflow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools.
0
1min
1min
10 sec. max
(Minimize soldering time)
Wave
300 Preheat 250 200 150 100 50 Natural Cooling
Cooling
Natural cooling in air is preferred, as this minimizes stresses within the soldered joint. When forced air cooling is used, cooling rate should not exceed 4C/second. Quenching is not recommended but if used, maximum temperature differentials should be observed according to the preheat conditions above.
Solder Temp.
T
230C to 250C
Cleaning
Flux residues may be hygroscopic or acidic and must be removed. AVX MLC capacitors are acceptable for use with all of the solvents described in the specifications MIL-STD202 and EIA-RS-198. Alcohol based solvents are acceptable and properly controlled water cleaning systems are also acceptable. Many other solvents have been proven successful, and most solvents that are acceptable to other components on circuit assemblies are equally acceptable for use with ceramic capacitors.
0
1 to 2 min
3 sec. max
(Preheat chips before soldering) T/maximum 150C
43
Internet/FAX/CD Rom/Software
Need Additional Information on AVX Products
Internet -
For more information visit us on the worldwide web at http://www.avxcorp.com
FAX Back Service -
Just dial 1-800-879-1613 and request the index for additional catalog information faxed to your FAX number.
CD ROM -
Or get in touch with your AVX representative for a CD Rom or copies of the catalogs and technical papers.
Software -
Comprehensive capacitor application software library which includes: SpiCap (for MLC chip capacitors) SpiTan (for tantalum capacitors) SpiCalci (for power supply capacitors) SpiMic (for RF-Microwave capacitors)
For AVX/Elco connector information contact your local AVX/Elco representative
NOTICE: Specifications are subject to change without notice. Contact your nearest AVX Sales Office for the latest specifications. All statements, information and data given herein are believed to be accurate and reliable, but are presented without guarantee, warranty, or responsibility of any kind, expressed or implied. Statements or suggestions concerning possible use of our products are made without representation or warranty that any such use is free of patent infringement and are not recommendations to infringe any patent. The user should not assume that all safety measures are indicated or that other measures may not be required. Specifications are typical and may not apply to all applications.
44
USA
AVX Myrtle Beach, SC Corporate Offices
Tel: 843-448-9411 FAX: 843-448-1943
EUROPE
AVX Limited, England European Headquarters
Tel: ++44 (0)1252 770000 FAX: ++44 (0)1252 770001
ASIA-PACIFIC
AVX/Kyocera, Singapore Asia-Pacific Headquarters
Tel: (65) 258-2833 FAX: (65) 350-4880
AVX Northwest, WA
Tel: 360-669-8746 FAX: 360-699-8751
AVX S.A., France
Tel: ++33 (1) 69.18.46.00 FAX: ++33 (1) 69.28.73.87
AVX/Kyocera, Hong Kong
Tel: (852) 2-363-3303 FAX: (852) 2-765-8185
AVX North Central, IN
Tel: 317-848-7153 FAX: 317-844-9314
AVX GmbH, Germany - AVX
Tel: ++49 (0) 8131 9004-0 FAX: ++49 (0) 8131 9004-44
AVX/Kyocera, Korea
Tel: (82) 2-785-6504 FAX: (82) 2-784-5411
AVX Northeast, MA
Tel: 508-485-8114 FAX: 508-485-8471
AVX GmbH, Germany - Elco
Tel: ++49 (0) 2741 2990 FAX: ++49 (0) 2741 299133
AVX/Kyocera, Taiwan
Tel: (886) 2-2516-7010 FAX: (886) 2-2506-9774
AVX Mid-Pacific, CA
Tel: 408-436-5400 FAX: 408-437-1500
AVX srl, Italy
Tel: ++390 (0)2 614571 FAX: ++390 (0)2 614 2576
AVX/Kyocera, China
Tel: (86) 21-6249-0314-16 FAX: (86) 21-6249-0313
AVX Southwest, AZ
Tel: 602-539-1496 FAX: 602-539-1501
AVX sro, Czech Republic
Tel: ++420 (0)467 558340 FAX: ++420 (0)467 2844
AVX/Kyocera, Malaysia
Tel: (60) 4-228-1190 FAX: (60) 4-228-1196
AVX South Central, TX
Tel: 972-669-1223 FAX: 972-669-2090
Elco, Japan
Tel: 045-943-2906/7 FAX: 045-943-2910
AVX Southeast, NC
Tel: 919-878-6357 FAX: 919-878-6462
Kyocera, Japan
Tel: (81) 75-593-4518 FAX: (81) 75-502-2705
AVX Canada
Tel: 905-564-8959 FAX: 905-564-9728
Contact:
A KYOCERA GROUP COMPANY
http://www.avxcorp.com
S-MCC20M299-C

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Price & Availability of 0805YA100CAT4A

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